SK Hynix Orders Advanced TC Bonders from ASMPT for HBM3E 12H Production

SK Hynix has ordered more than 30 thermal compression (TC) bonders from ASMPT for producing its latest HBM3E 12H memory chips. The equipment is crucial for stacking DRAM dies in high-bandwidth memory (HBM) production. SK Hynix employs a specialized bonding process called mass reflow molded underfill (MR-MUF) and has found ASMPT's equipment to outperform Hanmi Semiconductor's. This shift in supplier preference reflects the growing competition in the TC bonder market, as other companies like Hanwha Precision Machinery also attempt to supply to SK Hynix. The HBM3E 12H will be used with advanced GPU AI accelerators, with HBM3E projected to account for 80% of HBM demand by 2025.

In the dynamic world of semiconductor manufacturing, SK Hynix's latest move to secure more than 30 advanced thermal compression (TC) bonders from ASMPT signifies a strategic shift in the company's supplier preference [1]. This decision, crucial for producing its high-performance HBM3E 12H memory chips, underscores the growing competition in the TC bonder market and SK Hynix's commitment to innovation [2].

TC bonders play a pivotal role in HBM production by stacking and bonding DRAM dies on processed wafers using thermal compression. The quality and performance of these bonders significantly impact HBM yield [1]. With SK Hynix's specialized bonding process, mass reflow molded underfill (MR-MUF), ASMPT's equipment has been found to outperform Hanmi Semiconductor's, a significant supplier to SK Hynix in the past [1].

The HBM market is rapidly evolving, with HBM3e expected to become the industry standard for 2024, accounting for 35% of advanced process wafer input [1]. These high-bandwidth memory chips will be employed with advanced GPU AI accelerators, further emphasizing the importance of robust TC bonding technology. The shift towards ASMPT indicates SK Hynix's confidence in the supplier's ability to meet its demands and maintain the highest standards of quality [2].

Besides the technological advantages, SK Hynix's decision to diversify its supplier base reflects the company's commitment to localization efforts [1]. As the industry faces growing concerns over reliance on foreign equipment, SK Hynix, along with other major players, is intensifying its efforts to decrease this dependence [1].

In conclusion, SK Hynix's strategic shift towards ASMPT for TC bonders underscores the company's commitment to innovation and technological excellence in the highly competitive semiconductor market. With the growing demand for high-performance memory chips like HBM3e, this decision is expected to significantly contribute to SK Hynix's continued success in the industry.

References:
[1] TrendForce. (2024, June 25). News: Rising HBM production by Samsung and SK Hynix energizes Korea's TC bonder industry. Retrieved from https://www.trendforce.com/news/2024/06/25/news-rising-hbm-production-by-samsung-and-sk-hynix-energizes-koreas-tc-bonder-industry/
[2] SK Hynix. (2023, March 29). SK hynix Begins Volume Production of Industry-First HBM3E. Retrieved from https://news.skhynix.com/sk-hynix-begins-volume-production-of-industry-first-hbm3e/