Tower Semiconductor, Xscape Photonics create on-chip multi-color laser for AI datacenters.

Tower Semiconductor and Xscape Photonics have developed a monolithically integrated, optically pumped, programmable multi-color laser built on Tower's PH18 platform. This solution enables scalable CWDM/DWDM optical fabrics for disaggregated AI clusters and supports wavelength grids for high-speed, low-power optical interconnects in AI datacenters. The optical interconnect market is expected to grow driven by the demand for high-speed, low-power interconnects in AI datacenters.

Tower Semiconductor (NASDAQ/TASE: TSEM) and Xscape Photonics have jointly announced the development of the industry's first on-chip, optically pumped, multi-wavelength laser source. Built on Tower's PH18 Silicon Photonics platform, this innovative solution supports CWDM and DWDM wavelength grids, enabling scalable optical fabrics for AI datacenters. The technology addresses critical challenges in AI datacenter connectivity by offering higher bandwidth density and improved power efficiency.

The new laser source eliminates the need for multiple externally modulated lasers or hybrid III-V integration, simplifying the supply chain and reducing costs. According to LightCounting, the optical interconnect market for AI datacenters is projected to reach $10 billion by 2026 and $20 billion by 2030, driven by the demand for high-speed, low-latency connectivity in hyperscale AI deployments [1].

Xscape Photonics' ChromX platform, based on proprietary CombX technology, offers a programmable laser source compatible with existing silicon photonic components. This compatibility allows for seamless integration with Tower's established high-volume manufacturing process, reducing adoption barriers for existing customers. The PH18 platform's compatibility with current photonic components like modulators and detectors ensures a smooth transition for customers already using Tower's technology.

The collaboration between Tower Semiconductor and Xscape Photonics marks a significant technological advancement in optical interconnect technology. The new on-chip multi-wavelength laser technology could disrupt AI datacenter connectivity with simpler, more cost-effective solutions. The technology's ability to reduce component count, lower latency, and simplify design is particularly valuable for GPU-to-GPU and GPU-to-HBM (High-Bandwidth Memory) optical links in large AI computing clusters.

References:
[1] https://www.globenewswire.com/news-release/2025/08/25/3138294/0/en/Xscape-Photonics-and-Tower-Semiconductor-Unveil-the-Industry-s-First-Optically-Pumped-On-Chip-Multi-Wavelength-Laser-Platform-for-AI-Datacenter-Fabrics.html