Texas Instruments Powers Up as Stock Surges with New Chip Innovations
1min read Texas Instruments (TI) has recently garnered attention with the launch of its new power management chip, the TPS1685. The chip is designed to address the burgeoning power needs of modern data centers driven by the increasing adoption of high-performance computing and artificial intelligence (AI). A key feature of the TPS1685 is its 48V integrated hot-swap eFuse with power path protection, aimed at supporting data center hardware and processing demands.
In addition to the TPS1685, texas instruments premiered a new set of integrated gan power stage devices packaged in the industry-standard Transistor Outline with Leads (TOLL), including the LMG3650R035, LMG3650R025, and LMG3650R070. These products integrate high-performance gate drivers and 650V GaN FETs, achieving efficiency levels greater than 98% and power densities exceeding 100W/in³, all while providing protection against over-current, short circuits, and overheating. This feature set is crucial for AC/DC applications like server power supplies, which require delivering higher power within constrained spaces.
Robert Taylor, TI's General Manager for Industrial Power Design Services, emphasized the role of advanced power management technologies in supporting the growing energy demands posed by digital infrastructure, helping data centers diminish their environmental impact while addressing the needs of an increasingly digital world. The shift towards 48V power architectures allows system designers to improve efficiency and scalability, supporting components such as CPUs, GPUs, and AI accelerators.
The newly introduced 48V stackable integrated hot-swap eFuse further simplifies design processes and cuts solution size by 50% in comparison to existing market standards. These innovations consider the high power (>6kW) processing requirements faced by current data centers.
Available now for pre-production at TI.com, the TPS1685 and GaN power stages are prepared to ship, with support for various payment and delivery options. Evaluation modules for each device are also available, offering designers an effective means to integrate TI's latest advancements into their designs.
