Teradyne Unveils Magnum 7H: Next-Gen Memory Tester for HBM Devices

Teradyne has launched the Magnum 7H, a next-generation memory tester designed to meet the demands of high bandwidth memory (HBM) devices integrated with GPUs and accelerators in high-performance, generative AI servers. The Magnum 7H delivers high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale. It supports a wide range of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E, and offers comprehensive test coverage from base-die wafer test to memory core test and burn-in.

Title: Teradyne Launches Magnum 7H for High Bandwidth Memory Testing

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, has announced the launch of the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory (HBM) devices integrated with GPUs and accelerators in high-performance, generative AI servers. The Magnum 7H is engineered to deliver high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale.

The Magnum 7H supports a wide range of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It offers comprehensive test coverage, from base-die wafer test to memory core test and burn-in, ensuring the quality and reliability of HBM devices. Additionally, the Magnum 7H supports testing of pre-singulated HBM devices at the Known-Good-Stack-Die (KGSD) or Chip-on-Wafer level with traditional probers and probe cards, as well as post-singulated HBM with new bare-die probers/handlers for improved device quality.

The Teradyne Magnum 7H delivers enhanced device quality through superior DPS response time, resulting in higher device yield. It is ideally suited for testing HBM stacks that contain both logic base dies and DRAM dies. The Magnum 7H offers high-speed memory testing with a flexible algorithmic pattern generator (APG) and logic testing with the Logic Vector Memory (LVM) option. The Fail List Streaming (FLS) feature ensures high-speed error capture for both memory and logic testing.

The Magnum 7H is capable of high-speed testing of current HBM3/3E and next-generation HBM4/4E devices up to 4.5Gbps. It is configurable for up to 9,216 digital pins and 2,560 power pins, enabling superior touchdown efficiency at probe and resulting in 1.6x increased throughput in mass production environments.

The increasing demands for higher performance and efficiency in AI and cloud infrastructure applications are driving demand for HBM. Teradyne’s Magnum 7H is a next-generation memory tester engineered to test both today and tomorrow’s HBM devices with high parallelism, speed, and accuracy, across the entire manufacturing process.

For more information about the Magnum 7H and its capabilities, visit [Teradyne Magnum 7H](https://www.teradyne.com/products/magnum-7h/).

References
1. [Business Wire](https://www.businesswire.com/news/home/20250804458862/en/Teradyne-Unveils-Magnum-7H---The-Next-Generation-Memory-Tester-for-High-Bandwidth-Memory-Devices)
2. [Stock Titan](https://www.stocktitan.net/news/TER/teradyne-unveils-magnum-7h-the-next-generation-memory-tester-for-81i08h8g5ur6.html)