Shengmei Semiconductor Equipment Co., Ltd. was incorporated in California in January 1998 and re-registered in Delaware in November 2016. The company integrates R & D, design, manufacturing and sales to provide high-end semiconductor equipment to customers around the world. The main products are single wafer and trough wet cleaning equipment, electroplating equipment, stress-free polishing equipment, vertical furnace tube equipment, front-end coating and developing equipment and PECVD equipment. The company adheres to the development strategy of differentiated competition and innovation. Through self-developed monolithic megasonic cleaning technology, monolithic trough combined cleaning technology, electroplating technology, stress-free polishing technology and vertical furnace tube technology, the company provides customized equipment and process solutions to global wafer manufacturing, advanced packaging and other customers, effectively improving customers' production efficiency, improving product yield and reducing production costs.
