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Smartkem's Head of Technology Transfer, Steven Tsai, will present the company's MicroLED-in-Package (MiP4) Backlight at IDW Japan on December 4, 2025. This breakthrough technology is a new class of organic semiconductor technology that has been previously showcased at Touch Taiwan and Display Week. Tsai will present a technical paper titled 'From Chip to Panel: High-Brightness, Low-Power Mini-LED Backlighting via MicroLED-in-Package (MiP4)' in a special segment on Micro/Mini LEDs.
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