Sandisk and SK hynix Collaborate on High Bandwidth Flash Technology for Next-Generation AI Inference

Sandisk and SK hynix collaborate to establish the specification for High Bandwidth Flash, a new technology designed to deliver breakthrough memory capacity and performance for AI inference workloads. The companies aim to standardize the specification, define technology requirements, and explore the creation of a technology ecosystem for HBF. HBF is targeted to offer comparable bandwidth to High Bandwidth Memory (HBM) while delivering up to 8-16x the capacity of HBM at a similar cost. First samples of HBF memory are expected in the second half of 2026, with samples of the first AI-inference devices with HBF available in early 2027.

Sandisk Corporation (NASDAQ: SNDK) and SK hynix have signed a Memorandum of Understanding (MOU) to establish the specification for High Bandwidth Flash (HBF) memory technology. This collaboration aims to address the critical need for scalable memory in the AI industry, as AI models grow larger and more complex, demanding both massive bandwidth and significantly greater memory capacity.

HBF is designed to offer comparable bandwidth to High Bandwidth Memory (HBM) while delivering up to 8-16x the capacity of HBM at a similar cost. The technology is targeted for AI inference workloads in large data centers, small enterprises, and edge applications. Sandisk's advanced BiCS technology and proprietary CBA wafer bonding, developed over the past year with input from leading AI industry players, enable HBF [1].

Sandisk expects to deliver first samples of its HBF memory in the second half of 2026, with samples of the first AI-inference devices with HBF available in early 2027. The company has recently announced the formation of a Technical Advisory Board to guide the development and strategy of its groundbreaking HBF memory technology. The board will provide strategic guidance, technical insight, market perspective, and shape a standards-driven ecosystem [2].

Sandisk and SK hynix aim to standardize the HBF specification, define technology requirements, and explore the creation of a technology ecosystem for HBF. "By collaborating with SK hynix to define the High Bandwidth Flash specification, we are addressing the critical need for scalable memory in the AI industry," said Alper Ilkbahar, Executive Vice President and Chief Technology Officer at Sandisk [1].

Today at 11:40 am Pacific time, Sandisk will deliver a keynote address at FMS 2025 in Santa Clara, Calif., including the latest HBF-related updates. The company will also showcase its innovative storage solutions at FMS Booth #607 [3].

References:
[1] https://www.sandisk.com/company/newsroom/press-releases/2025/2025-08-06-sandisk-to-collaborate-with-sk-hynix-to-drive-standardization-of-high-bandwidth-flash-memory-technology
[2] https://www.marketscreener.com/news/sandisk-to-collaborate-with-sk-hynix-to-drive-standardization-of-high-bandwidth-flash-memory-technology
[3] https://www.techpowerup.com/339675/sandisk-to-collaborate-with-sk-hynix-to-drive-standardization-of-high-bandwidth-flash-memory-technology