Micron Technology Soars 3.21% on AI, Smartphone Tech Gains

Micron Technology rose 3.21% in pre-market trading on June 24, 2025, reflecting a positive sentiment among investors.

Micron Technology has recently secured a patent for a "car electronic control unit pre-start" technology, which is expected to enhance the performance of human-machine interfaces. This development underscores the company's commitment to innovation and its ability to translate technological advancements into practical applications.

In the smartphone sector, Micron's LPDDR5X memory technology has demonstrated significant improvements in dynamic voltage adjustment, achieving a 10ns delay breakthrough. This technology has been successfully integrated into the Xiaomi 14 Ultra, enhancing its AI photography capabilities by increasing the RAW burst cache depth to 48 frames, providing a seamless "zero-wait" experience. This integration highlights Micron's ability to deliver end-to-end solutions that enhance user experience.

Micron's HBM3E product line is designed to meet the growing demand for AI computing power. With a 12-layer TSV stacking structure and a 1024-bit wide bus, it achieves a bandwidth of 1.2TB/s. This technology has been successfully applied to NVIDIA's AI acceleration cards, reducing the training time for large models by 18%. Micron's "limited EUV" manufacturing strategy ensures a stable yield rate of over 92%, providing clients with a reliable supply chain. This combination of technological breakthroughs and production stability positions Micron to capture 28% of the AI acceleration card market in 2025.

In China, Micron's local solutions have proven effective in improving DRAM yield rates. The parallel testing technology developed at the Xi'an base has increased testing efficiency by four times, complementing Changxing Storage's wafer repair technology. This collaboration has reduced the production cost of storage modules by 12% for Chinese clients. Additionally, Micron has fostered a local supply chain ecosystem in Shaanxi, increasing the localization rate of 3D NAND packaging to 35%, ensuring compliance with China's data security laws. This "global technology with local delivery" model is redefining the strategy of multinational semiconductor companies in China.