Micron Technology Ranks 24th in Trading Volume with $24.98 Billion as HBM4 Memory Revolutionizes AI and Data Centers

On June 11, 2025, Micron Technology (MU) saw a trading volume of $24.98 billion, ranking 24th in the day's stock market activity. The company's stock price rose by 1.66%, marking its eighth consecutive day of gains, with an overall increase of 22.84% over the past eight days.

Micron has begun shipping samples of its new High Bandwidth Memory 4 (HBM4) to key customers. This next-generation memory solution is designed to support next-gen AI platforms, offering a 36GB capacity and over 2TB/s bandwidth. The HBM4 modules feature a 2,048-bit interface, doubling the memory interface from previous generations and delivering sustained bandwidth exceeding 2 terabytes per second. This advancement is expected to significantly enhance performance for AI and high-performance computing applications.

Micron's HBM4 memory is positioned to capitalize on the expanding AI and data center demand. The company's senior vice president, Raj Narasimhan, highlighted that HBM4 will enable AI accelerators to respond faster and reason more effectively. The new memory technology offers over 60% better performance and more than 20% better power efficiency compared to the previous generation, HBM3E. These improvements are crucial for maximizing data center efficiency and supporting the growing demands of AI workloads.

NVIDIA and AMD are among the first companies expected to adopt HBM4 memory in their products. NVIDIA plans to use the modules in its Rubin-Vera AI accelerators, set to launch in the second half of 2026, while AMD is likely to integrate HBM4 into its next-generation Instinct MI400 series. Micron plans to ramp up HBM4 production in 2026, aligning with the launch of customers' next-generation AI platforms. As the company moves towards large-scale production, it will face challenges in thermal management and demonstrating real-world performance, particularly in supporting demanding AI workloads and HPC tasks.