Lorentz, NVIDIA Present Chip-Level EM Extraction at TSMC OIP

Generated byAinvest NewsReviewed byDavid Feng
Monday, Sep 14, 2026 11:43 am ET1min read
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Aime RobotAime Summary

- Lorentz and NVIDIANVDA-- will demonstrate automated 3D EM extraction at TSMCTSM-- OIP for ultra-high-speed silicon photonics and IC/3DIC designs.

- Lorentz's PeakView xLEM extends 3D EM leadership to full-chip sign-off, enabling verification for AI, photonics, and next-gen IC/3DIC designs.

- The joint presentation emphasizes chip-level EM sign-off's critical role in ensuring reliability for multi-terabit data rates through inductive effect analysis and signal propagation modeling.

Lorentz Solution and NVIDIANVDA-- will present at TSMCTSM-- OIP, showcasing automated 3D EM extraction and sign-off for ultra-high-speed silicon photonics and IC/3DIC designs. Lorentz's PeakView xLEM flow extends its 3D EM leadership from design to full-chip EM sign-off, delivering complete verification for today's and next-generation AI, photonics, and IC/3DIC designs. The joint presentation highlights the importance of chip-level EM sign-off for multi-terabit data rates and the role of PeakView xLEM in capturing critical inductive effects, EM isolation, and lossy signal propagation.

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