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Lightwave Logic has partnered with a Fortune Global 500 company to enhance Co-Packaged Optics (CPO) applications. The collaboration aims to develop a custom electro-optic polymer material for AI scale-up processes and integrate electro-optic polymers into standard silicon photonics foundry processes. The partnership covers technical fields including high-speed modulator simulation and design, product testing and packaging processes, and developing a Process Design Kit. The ultimate goal is to prove electro-optic polymers can deliver products with high yield potential and scale up to mass production.

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