Lightwave Logic Achieves Telcordia 85/85 Test & Enhances Moisture & Oxygen Resistance with Fourth-Generation Encapsulation Technology
ByAInvest
Tuesday, Jul 15, 2025 4:44 pm ET1min read
LWLG--
The Telcordia GR-468 85/85 test subjects materials to 85°C at 85% relative humidity for 1,000 hours, a gold standard for reliability qualification in the telecom and datacom industries. Lightwave Logic's Perkinamine™ polymer demonstrated exceptional environmental stability, with an average loss of only 1.6% after 1,000 hours of testing [2].
In addition to the environmental stress test, Lightwave Logic's process development team has achieved a significant breakthrough with its fourth-generation atomic layer deposition (ALD) encapsulation material. This new material demonstrated an oxygen transmission rate (OTR) of 1.4 × 10⁻⁶ g/m²/day, approaching the measurement limit of state-of-the-art OTR instrumentation. This performance far exceeds the "gold-box" standard of 7 × 10⁻⁶ g/m²/day for lifetime reliability [1].
The company is preparing this fourth-generation encapsulation material for its next-release back-end-of-line (BEOL) Process Design Kit (PDK) for integration into silicon photonics foundries. According to Yves LeMaitre, CEO of Lightwave Logic, "Achieving full Telcordia 85/85 certification and improving barrier performance by two orders of magnitude are watershed achievements for our platform. Similar to the trajectory of Organic LEDs, electro-optic polymers are demonstrating that they now meet the reliability requirements for deployment in real-world applications, including AI factory scale-out and hyperscalers front-end networking" [1].
These achievements position Lightwave Logic's technology for deployment in AI factory scale-out and hyperscaler front-end networking applications, significantly enhancing the commercial viability of high-speed optical interconnects. The company's strategic partnerships with foundries for scalable device manufacturing and its critical design win process with companies actively engaged in its commercial pipeline further underscore its potential for success in the photonics industry [1].
References:
[1] https://www.morningstar.com/news/accesswire/1049059msn/lightwave-logic-inc-announces-perkinaminetm-polymer-reliability-breakthrough-passes-telcordia-8585-test-develops-enhanced-moisture-oxygen-resistance-via-fourth-generation-encapsulation-technology
[2] https://www.stocktitan.net/news/LWLG/lightwave-logic-inc-announces-perkinamine-tm-polymer-reliability-r6wo52jwtdzk.html
MORN--
Lightwave Logic announces its Perkinamine polymer has passed the Telcordia GR-468 85/85 environmental stress test, validating its long-term reliability under harsh conditions. The polymer maintains performance over time, meeting industry requirements for deployment in telecom and datacom infrastructure. The company also achieved a breakthrough with its fourth-generation atomic layer deposition encapsulation material, demonstrating an oxygen transmission rate approaching the measurement limit.
Englewood, Colorado / July 15, 2025 / Lightwave Logic, Inc. (NASDAQ:LWLG), a leading provider of high-performance electro-optic (EO) polymer materials, has announced a significant breakthrough in the reliability of its Perkinamine™ polymer. The company's latest-generation polymer has successfully passed the rigorous Telcordia GR-468 85/85 environmental stress test, validating its long-term reliability under harsh environmental conditions [1].The Telcordia GR-468 85/85 test subjects materials to 85°C at 85% relative humidity for 1,000 hours, a gold standard for reliability qualification in the telecom and datacom industries. Lightwave Logic's Perkinamine™ polymer demonstrated exceptional environmental stability, with an average loss of only 1.6% after 1,000 hours of testing [2].
In addition to the environmental stress test, Lightwave Logic's process development team has achieved a significant breakthrough with its fourth-generation atomic layer deposition (ALD) encapsulation material. This new material demonstrated an oxygen transmission rate (OTR) of 1.4 × 10⁻⁶ g/m²/day, approaching the measurement limit of state-of-the-art OTR instrumentation. This performance far exceeds the "gold-box" standard of 7 × 10⁻⁶ g/m²/day for lifetime reliability [1].
The company is preparing this fourth-generation encapsulation material for its next-release back-end-of-line (BEOL) Process Design Kit (PDK) for integration into silicon photonics foundries. According to Yves LeMaitre, CEO of Lightwave Logic, "Achieving full Telcordia 85/85 certification and improving barrier performance by two orders of magnitude are watershed achievements for our platform. Similar to the trajectory of Organic LEDs, electro-optic polymers are demonstrating that they now meet the reliability requirements for deployment in real-world applications, including AI factory scale-out and hyperscalers front-end networking" [1].
These achievements position Lightwave Logic's technology for deployment in AI factory scale-out and hyperscaler front-end networking applications, significantly enhancing the commercial viability of high-speed optical interconnects. The company's strategic partnerships with foundries for scalable device manufacturing and its critical design win process with companies actively engaged in its commercial pipeline further underscore its potential for success in the photonics industry [1].
References:
[1] https://www.morningstar.com/news/accesswire/1049059msn/lightwave-logic-inc-announces-perkinaminetm-polymer-reliability-breakthrough-passes-telcordia-8585-test-develops-enhanced-moisture-oxygen-resistance-via-fourth-generation-encapsulation-technology
[2] https://www.stocktitan.net/news/LWLG/lightwave-logic-inc-announces-perkinamine-tm-polymer-reliability-r6wo52jwtdzk.html

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