Kezhuo Semiconductor Secures 70 Million Yuan for Wafer Dicing Machine Commercialization

Kezhuo Semiconductor, a company specializing in high-end semiconductor packaging equipment, has successfully completed its first round of commercial financing, securing 70 million yuan. This funding is poised to accelerate the commercialization of the company's wafer dicing machines and bolster the domestic production of high-end packaging equipment.

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The company, founded in 2016, is headquartered in Dongguan and focuses on the research, development, and sales of semiconductor packaging equipment. Kezhuo's breakthrough came in 2018 when it successfully developed the first domestically produced 12-inch fully automated wafer dicing machine. After eight years of research and development, eight iterations, and over four years of production line validation, Kezhuo has established a series of equipment, including wafer dicing machines, IC product dicing machines, high-speed sorting machines, and flip chip bonding machines. These products have been adopted by nearly 20 packaging clients, with a precision of 2 microns and a reputation for stability and reliability, placing Kezhuo at the forefront of the domestic market.

Wafer dicing is a critical step in the semiconductor packaging process, and wafer dicing machines are essential equipment in this stage. Due to the high precision and stability required, as well as the relatively late start of the relevant industry in China, over 90% of the domestic market relies on imports. High-end models, such as 12-inch fully automated wafer dicing machines, are almost entirely dependent on foreign suppliers. Given the significant investment costs associated with these machines and the rapid growth of the domestic market, the development of indigenous technology is crucial for achieving self-sufficiency and cost efficiency in the semiconductor industry.

Kezhuo Semiconductor aims to make 2025 a pivotal year for its commercialization efforts. The company plans to expand its client base to nearly 20 major customers, develop higher-end functionalities for existing equipment, and validate new types of equipment. Additionally, Kezhuo will expand its modern, dust-free assembly workshop, recruit talent in sales, production, and management, and enhance its sales, production, and supply chain management capabilities. These efforts are part of Kezhuo's strategic goal to become a leading domestic player in the semiconductor packaging equipment market.