Hua Hong Semiconductor Appoints Intel Veteran as New President

Hua Hong Semiconductor Limited (HK:1347), China's second-largest foundry, has named Peng Bai, a former global vice president of Intel, as its new president. Bai, who will assume the role on January 1, 2025, brings over three decades of experience in integrated circuits manufacturing, process integration management, yield engineering, and R&D. His appointment comes amidst a broader leadership reorganization at Hua Hong Group, with Jian Qin taking over as chairman and Junjun Tang stepping down from the president position to focus on his new duties as chairman and executive director.

Bai's extensive experience at Intel, where he held various leadership positions, including co-director of Logic Technology Development in the Technology and Manufacturing Group, is expected to bring valuable insights and expertise to Hua Hong. His background in developing and transferring next-gen silicon technologies that produce future Intel microprocessors and SoCs could help Hua Hong improve its manufacturing processes and technology. Additionally, his global perspective, gained from his role as a global vice president at Intel, could help Hua Hong better understand and cater to international market demands.

Hua Hong Semiconductor's appointment of Bai as president comes at a time when the company is expanding its advanced specialty process capabilities. The start of production at its 12-inch specialty process production line in Wuxi, focusing on automotive-grade chip manufacturing, marks a new milestone for the company. With Bai's experience in developing and transferring next-gen silicon technologies, he could play a crucial role in driving this expansion and ensuring the success of these new production lines.

Bai's appointment also comes as Hua Hong is expanding its partnerships with international companies. STMicroelectronics recently announced a strategic partnership with Hua Hong to commence production of 40nm process MCUs in Shenzhen by the end of 2025. Bai's experience in building strategic partnerships could help Hua Hong attract more international clients, further strengthening its competitive position.

In conclusion, Hua Hong Semiconductor's appointment of Peng Bai as its new president is a strategic move that leverages his extensive experience in the semiconductor industry and global perspective. His leadership is expected to bring valuable insights and expertise to Hua Hong, helping the company improve its manufacturing processes, technology, and international relationships. As Hua Hong continues to expand its advanced specialty process capabilities and partnerships, Bai's appointment could prove to be a significant factor in the company's future success.