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The partnership between
(GF) and Silicon Labs has emerged as a pivotal force in the evolution of wireless connectivity, particularly as the industry transitions toward Wi-Fi 7. By leveraging GF’s 40LP platform—a process technology optimized for low power consumption and high signal integrity—the duo has already shipped over 10 million Wi-Fi units, including the SiWX917 Wi-Fi 6 chip, designed for battery-powered IoT devices [1]. This collaboration not only addresses the immediate challenges of power efficiency and connectivity reliability but also positions both companies to capitalize on the explosive growth of Wi-Fi 7, a market projected to expand at a compound annual growth rate (CAGR) of 61.5% through 2030 [2].GF’s 40LP platform is central to this partnership’s success. Its low leakage in standby mode and exceptional noise-to-signal ratio enable IoT devices to maintain persistent connectivity without draining batteries—a critical requirement for applications ranging from smart homes to industrial sensors [3]. For example, the SiWX917 chip, built on this platform, extends battery life while ensuring secure, real-time data transmission [4]. This technological foundation is not merely a stepping stone for Wi-Fi 6 but a scalable solution for the more demanding requirements of Wi-Fi 7, which promises data rates up to 46 Gbps through features like 320 MHz channel bandwidth and 4K QAM modulation [5].
GF’s roadmap further underscores its commitment to future-proofing this partnership. The company’s FDX™ and FinFET technologies, including 22FDX® and 12LP+ FinFET, are already enabling Wi-Fi 7 development and are poised to support the next-generation Wi-Fi 8 standard [6]. These platforms offer ultra-low power consumption and robust RF capabilities, making them ideal for the high-performance, energy-efficient devices that will define the Wi-Fi 7 era [6].
The partnership’s strength lies in its complementary strengths. GF’s advanced manufacturing capabilities provide the scalability needed to meet the surging demand for IoT connectivity, while Silicon Labs’ expertise in low-power wireless design ensures that the resulting chips meet the stringent performance requirements of modern applications [1]. This synergy is particularly valuable in the context of Wi-Fi 7, which demands not only faster data rates but also improved latency and multi-link operation (MLO) to support bandwidth-intensive use cases like 8K streaming and cloud-based AR/VR [5].
Moreover, the partnership aligns with broader market trends. The global Wi-Fi 7 market is expected to be dominated by hardware manufacturers, with routers, access points, and gateways driving adoption [2]. GF’s ability to deliver cost-effective, high-volume production solutions positions it as a critical enabler for companies like Silicon Labs, which can then focus on innovating at the application layer. This division of labor accelerates time-to-market for Wi-Fi 7 products, a key competitive advantage in a rapidly evolving landscape.
For investors, the GF-Silicon Labs partnership represents a dual opportunity. First, it highlights the growing importance of specialty foundries in the semiconductor industry. As Wi-Fi 7 adoption accelerates, companies with advanced RF and low-power manufacturing capabilities—like GF—are likely to see increased demand for their services [6]. Second, the partnership underscores the potential of IoT as a growth engine. With over 29 billion IoT devices projected to be in use by 2030 [5], the ability to produce energy-efficient, high-performance connectivity solutions will be a key differentiator.
However, the path to Wi-Fi 7 dominance is not without challenges. The transition from Wi-Fi 6 to Wi-Fi 7 requires significant R&D investment and infrastructure upgrades. Yet, GF’s existing roadmap and Silicon Labs’ track record in wireless innovation suggest that the partnership is well-positioned to navigate these hurdles. For instance, GF’s 12LP+ FinFET technology is already being used to develop chips that meet the stringent FEM (front-end module) performance requirements of Wi-Fi 7, including low latency and high data throughput [6].
The collaboration between GlobalFoundries and Silicon Labs is more than a technical achievement—it is a strategic alignment that bridges the gap between current IoT demands and the future of wireless infrastructure. By combining GF’s cutting-edge manufacturing with Silicon Labs’ wireless expertise, the partnership is not only scaling Wi-Fi 6 adoption but also laying the groundwork for Wi-Fi 7’s transformative potential. As the market for next-generation connectivity expands, investors who recognize the value of this synergy may find themselves well-positioned to benefit from the wireless infrastructure boom.
Source:
[1] GlobalFoundries and Silicon Labs Partner to Scale Industry-Leading Wi-Fi Connectivity [https://investors.gf.com/news-releases/news-release-details/globalfoundries-and-silicon-labs-partner-scale-industry-leading]
[2] Global Wi-Fi 7 Market to Grow at 61.5% CAGR Through 2030 [https://www.bccresearch.com/pressroom/ift/global-wi-fi-7-market-to-grow-at-615-cagr-through-2030?srsltid=AfmBOopRPBAVteOGun28Q_oL_YcPFYx_0Tng8yEh-6XgybwynXti5Brq]
[3] GlobalFoundries Ships 10M Silicon Labs Wi-Fi Units [https://www.stocktitan.net/news/GFS/global-foundries-and-silicon-labs-partner-to-scale-industry-leading-ltalng0jxyb5.html]
[4] GlobalFoundries and Silicon Labs ship 10 million Wi-Fi chips [https://www.streetinsider.com/Corporate+News/GlobalFoundries+and+Silicon+Labs+ship+10+million+Wi-Fi+chips/25265176.html]
[5] Wi-Fi 7: Powering the Next Wave of Global Connectivity [https://blog.bccresearch.com/wi-fi-7-powering-the-next-wave-of-global-connectivity]
[6] How GF FDX™ and FinFET solutions are powering the next generation of Wi-Fi [https://gf.com/blog/how-gf-fdx-and-finfet-solutions-are-powering-the-next-generation-of-wi-fi/]
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