Franklin Wireless Partners with AiM Future for Lightweight AI Model Development
ByAinvest
Thursday, Aug 28, 2025 1:18 pm ET1min read
FKWL--
Franklin Wireless, known for its advanced mobile hotspots, routers, and M2M/IoT hardware and software, will leverage its expertise in 5G and 4G LTE technologies. AiM Future, a leading AI semiconductor design company, will provide NPU accelerator IP and edge AI SoCs. The collaboration will focus on developing a lightweight AI model that can efficiently run on MCU devices and a 1 TOPS AI SoC chipset integrated with a communication chip [1][2].
The joint effort will initially target the North American market, with Franklin Wireless utilizing its established sales network to deliver the chipsets quickly. AiM Future will develop models capable of running in high-performance MCU environments, while Franklin Wireless will provide detailed chip specifications and define target application requirements [1][2].
"This collaboration not only marks AiM Future’s entry into the North American market but also strengthens our competitiveness in the AI–IoT convergence sector. By delivering cost-efficient, high-performance AI solutions, we can accelerate revenue growth and market adoption," said Changsoo Kim, CEO of AiM Future [1][2].
The partnership aims to expand both companies' technological reach and bring innovative AI-powered communication solutions to the global IoT and telecommunications markets [1][2].
References:
[1] https://www.morningstar.com/news/business-wire/20250812809031/aim-future-and-franklin-wireless-sign-mou-to-jointly-develop-lightweight-ai-model-and-high-efficiency-1-tops-ai-soc-chipset
[2] https://finance.yahoo.com/news/aim-future-franklin-wireless-sign-163500498.html
Franklin Wireless Corp. has signed an MoU with AiM Future for a lightweight AI model. Franklin Wireless is a global provider of integrated wireless solutions, utilizing 5G and 4G LTE technologies. Their products include mobile hotspots, fixed wireless routers, and mobile device management solutions. The partnership aims to enhance communication and connectivity for individuals and enterprises, as well as drive IoT and M2M applications.
Franklin Wireless Corp. and AiM Future have signed a Memorandum of Understanding (MOU) to jointly develop a lightweight AI model and a high-efficiency 1 TOPS AI SoC chipset. This strategic partnership aims to enhance communication and connectivity solutions, particularly in the IoT and M2M sectors [1][2].Franklin Wireless, known for its advanced mobile hotspots, routers, and M2M/IoT hardware and software, will leverage its expertise in 5G and 4G LTE technologies. AiM Future, a leading AI semiconductor design company, will provide NPU accelerator IP and edge AI SoCs. The collaboration will focus on developing a lightweight AI model that can efficiently run on MCU devices and a 1 TOPS AI SoC chipset integrated with a communication chip [1][2].
The joint effort will initially target the North American market, with Franklin Wireless utilizing its established sales network to deliver the chipsets quickly. AiM Future will develop models capable of running in high-performance MCU environments, while Franklin Wireless will provide detailed chip specifications and define target application requirements [1][2].
"This collaboration not only marks AiM Future’s entry into the North American market but also strengthens our competitiveness in the AI–IoT convergence sector. By delivering cost-efficient, high-performance AI solutions, we can accelerate revenue growth and market adoption," said Changsoo Kim, CEO of AiM Future [1][2].
The partnership aims to expand both companies' technological reach and bring innovative AI-powered communication solutions to the global IoT and telecommunications markets [1][2].
References:
[1] https://www.morningstar.com/news/business-wire/20250812809031/aim-future-and-franklin-wireless-sign-mou-to-jointly-develop-lightweight-ai-model-and-high-efficiency-1-tops-ai-soc-chipset
[2] https://finance.yahoo.com/news/aim-future-franklin-wireless-sign-163500498.html

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