DuPont's Advanced Circuit Solutions Drive Innovation in AI Sector

DuPont, a global leader in advanced interconnect technology, is showcasing its cutting-edge circuit materials at Intelligent Asia Thailand 2025. The event, held at the Bangkok International Trade & Exhibition Centre (BITEC) from March 6 to 8, 2024, provides a platform for DuPont to highlight its innovative solutions for fine-line technology, signal integrity, and thermal management, addressing the specific challenges faced by the AI infrastructure sector.

The AI sector is rapidly evolving, with a growing demand for device miniaturization, high computational speed, and high reliability interconnects. DuPont's advanced circuit materials are designed to meet these evolving technology challenges, enabling innovation in AI server stations and other AI-related applications. The company's expertise and broad product portfolio position it to enable the increasing needs for device miniaturization and high computational speed and performance in the AI sector.

DuPont's Copper Gleam PPR-II/III pulse acid plating copper is a new generation electroplating solution designed for advanced multilayer boards (MLBs) and AI server station applications. This solution has superior throwing power for through-hole plating, ensuring better plated thickness distribution on the surface, which fulfills fine-line and high reliability requirements. Additionally, DuPont's Riston DI9500M & DI8600 and FD3000M dry film photoresists are multi-wavelength direct imaging solutions designed for use in pitch greater than or equal to 70μm tech/etch processes for both rigid and flex PCBs. These dry film photoresists provide fine-line capability with excellent resolution and adhesion performance, improving overall yield for manufacturers.

DuPont's solutions for signal integrity are designed for high-frequency and high-speed data transfer applications, ensuring reliable signal integrity. For example, DuPont's Circuposit 6800W electroless copper plus Copper Gleam PS-100 flash copper are designed for enhanced reliability performance in multi-stack micro-via designs. This combination of a horizontal electroless copper process with a flash electroplating step creates a more efficient single process solution, making it well-suited for applications in AI server stations. Furthermore, DuPont's Pyralux AP flexible copper-clad laminate is a versatile, double-sided laminate that features an all-polyimide dielectric and DuPont's unique manufacturing process. This laminate offers exceptional reliability and reduced transmission loss, fulfilling customers' requirements for high-speed, high-frequency signal transmission.

DuPont's solutions for thermal management help dissipate heat generated by high-performance AI systems. For instance, DuPont's Microfill EVF-III acid copper is a new generation via-filling technology designed for fine-line HDI applications suitable for automotive applications. This solution is highly effective for panel via filling, providing excellent throwing power for improved through-hole performance, which aids in heat dissipation. Additionally, DuPont offers a thermally conductive insulated metal PCB substrate system used for heat dissipation in electronics circuit boards, further contributing to the thermal management of AI systems.

DuPont's global presence and strategic partnerships enable leading PCB manufacturers to start and grow their businesses in the rapidly expanding Southeast Asian market, particularly in the AI sector. As a leader in advanced interconnect technology, DuPont has a broad product portfolio that addresses the increasing needs for device miniaturization and high computational speed and performance in the AI sector. By leveraging DuPont's expertise and global presence, leading PCB manufacturers can access cutting-edge materials and solutions that help them stay competitive in the rapidly evolving AI market.

In conclusion, DuPont's advanced circuit materials address the specific challenges faced by the AI infrastructure sector by providing solutions that enhance fine-line technology, signal integrity, and thermal management. These solutions enable the creation of smaller, more efficient, and higher-performing AI systems, contributing to the miniaturization and high computational speed and performance required in the AI sector. DuPont's global presence and strategic partnerships further empower leading PCB manufacturers to start and grow their businesses in the rapidly expanding Southeast Asian market, particularly in the AI sector.