Coherent Unveils Next-Gen 2D VCSEL and Photodiode Arrays for AI-Driven Optical Interconnects
ByAinvest
Thursday, Sep 25, 2025 9:27 am ET1min read
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The new technology features a high-density 2D array architecture (1.6T, 850 nm, 32x50G NRZ) built on their 100G PAM4 multimode platform. This architecture enables copper link replacement and optimal degree of parallelism, offering advantages in power efficiency, reduced latency, and cost effectiveness. The arrays are designed to support the transition to Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO), accelerating the deployment of AI/ML workloads in hyperscale datacenters [1].
Coherent plans to expand its portfolio with 1060 nm backside-emitting flip-chip VCSEL/PD array variants in 2026. These variants will support the transition to Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO), further enhancing the company's product offerings for next-generation optical networking [1].
The introduction of these arrays marks an important step forward in enabling parallelism, power-efficient design, and flexible architectures that will shape the future of AI and machine learning networks. Attendees can experience this innovation firsthand at ECOC 2025, Booth C3124 in Copenhagen, Denmark, September 29 – October 1, 2025 [1].
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Coherent Corp. has announced the introduction of next-gen 2D VCSEL and photodiode arrays for AI-driven optical interconnects. The arrays enable power-efficient and compact links optimized for short reach, addressing surging data traffic demands in modern datacenters. Coherent's 100G PAM4 multimode VCSEL and PD platform provides low power consumption, reduced latency, and cost efficiency, supporting the transition to Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO).
Coherent Corp. (NYSE: COHR), a global leader in photonics, has announced the introduction of next-generation 2D Vertical-Cavity Surface-Emitting Laser (VCSEL) and photodiode (PD) arrays designed for AI-driven optical interconnects. These arrays are optimized for "slow and wide" interconnections in scale-up AI networks, addressing surging data traffic demands in modern datacenters [1].The new technology features a high-density 2D array architecture (1.6T, 850 nm, 32x50G NRZ) built on their 100G PAM4 multimode platform. This architecture enables copper link replacement and optimal degree of parallelism, offering advantages in power efficiency, reduced latency, and cost effectiveness. The arrays are designed to support the transition to Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO), accelerating the deployment of AI/ML workloads in hyperscale datacenters [1].
Coherent plans to expand its portfolio with 1060 nm backside-emitting flip-chip VCSEL/PD array variants in 2026. These variants will support the transition to Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO), further enhancing the company's product offerings for next-generation optical networking [1].
The introduction of these arrays marks an important step forward in enabling parallelism, power-efficient design, and flexible architectures that will shape the future of AI and machine learning networks. Attendees can experience this innovation firsthand at ECOC 2025, Booth C3124 in Copenhagen, Denmark, September 29 – October 1, 2025 [1].

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