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The CMP slurry and pad market is expected to grow 6% in 2025 to $3.6 billion, driven by recovery in logic segments and expanding CMP process steps across next-generation device technologies and advanced packaging. The growth is fueled by advanced 3D NAND, FinFET 3nm, GAA, and emerging backside power delivery structures, which require more CMP steps per wafer. The market is also driven by the adoption of advanced packaging, which is expected to rise from 36% of total packaging in 2023 to 46% by 2029. Supplier activity remains strong, with Entegris announcing a $700M R&D investment and Fujifilm expanding slurry production.

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