Ceva Retains Top Spot in Wireless Connectivity IP with 68% Market Share

Ceva retains top spot in Wireless Connectivity IP with a 68% market share for 2024, according to the IPnest 2025 Design IP Report. The company's comprehensive portfolio covers multiple wireless standards, including Bluetooth, Wi-Fi, UWB, and cellular IoT. Ceva has expanded its offerings with the introduction of Bluetooth 7 RF IP on TSMC 12nm, enhancing its wireless solutions.

Ceva, Inc. (NASDAQ: CEVA), a leading licensor of silicon and software IP for the Smart Edge, has maintained its dominant position in Wireless Connectivity IP according to IPnest's 2025 Design IP Report. The company achieved a 68% market share in 2024, more than 10 times larger than its closest competitor. This commanding lead reflects Ceva's continued dominance in Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT IP solutions, which are foundational to the next generation of smart edge devices [1].

The growing convergence of wireless connectivity, on-device AI, and sensor fusion is driving a new wave of smart edge devices, particularly in consumer and industrial SoCs and MCUs. As these devices increasingly require real-time decision-making, local data processing has become essential for reducing latency, preserving privacy, and improving energy efficiency. Ceva's integrated IP portfolio supports this shift by allowing seamless implementation of connectivity, AI NPUs, and sensor technologies, helping customers deliver smarter, more responsive, and secure products [2].

Ceva's comprehensive wireless connectivity IP portfolio, known as the Ceva-Waves™ family, spans Bluetooth, Wi-Fi, UWB, 802.15.4, and cellular IoT. The portfolio includes the Ceva-Waves-Links platform for multi-standard configurations and the Dragonfly platform for LTE-M and NB-IoT connectivity, which is ideal for low-power, wide-area applications such as asset tracking, smart metering, and industrial monitoring [3].

In a significant development, Ceva recently expanded its Ceva-Waves platform to include RF IP, introducing its first Bluetooth 7 RF IP on TSMC 12nm, alongside support for IEEE 802.15.4. This enhancement further solidifies Ceva's commitment to delivering complete, silicon-proven wireless solutions from baseband to RF [1].

Michael Boukaya, Chief Operating Officer at Ceva, stated, "Wireless connectivity is foundational to the smart edge, and our continued leadership in this space reflects the trust our customers place in Ceva to deliver high-performance, low-power IP solutions. The latest IPnest report reinforces our strategy to build on this leadership by offering a unified IP portfolio that integrates wireless, sensing, and AI capabilities—enabling our customers to accelerate innovation across the evolving AIoT landscape" [1].

Ceva's leadership in wireless connectivity IP underscores its pivotal role in enabling the intelligent, connected world. The company's headquarters are in Rockville, Maryland, with a global customer base supported by operations worldwide. Ceva's employees are among the leading experts in their areas of specialty, consistently solving the most complex design challenges, enabling customers to bring innovative smart edge products to market [1].

References:
[1] https://www.prnewswire.com/news-releases/ceva-retains-top-spot-in-wireless-connectivity-ip-in-latest-ipnest-report-302515659.html
[2] https://www.marketscreener.com/news/ceva-retains-top-spot-in-wireless-connectivity-ip-in-latest-ipnest-report-ce7c5fd9df8ff025
[3] https://www.stocktitan.net/news/CEVA/ceva-retains-top-spot-in-wireless-connectivity-ip-in-latest-i-pnest-x7rvg1s46qoa.html