CEVA and ALi Corporation Collaborate on Edge AI for Next-Gen Video Platforms

Saturday, Aug 9, 2025 4:52 am ET1min read

Ceva and ALi Corporation have formed a strategic partnership to integrate Ceva's NeuPro-Nano and NeuPro-M Neural Processing Units into ALi's VDSS platform. The collaboration aims to enhance AI processing capabilities in smart edge devices, targeting ultra-low power applications with scalable performance. The partnership strengthens ALi's ASIC design services and accelerates AI SoC development for various industry partners.

In a significant move to bolster AI capabilities in smart edge devices, Ceva, Inc. (NASDAQ: CEVA) and ALi Corporation have announced a strategic partnership to integrate Ceva's advanced Neural Processing Units (NPUs) into ALi's next-generation Video Display Sub-System (VDSS) platform. The collaboration, announced on August 7, 2025, aims to deliver high-efficiency AI acceleration for smart edge devices, including intelligent smart displays, set-top boxes, and other visual computing devices [1].

The partnership involves the integration of Ceva's NeuPro-Nano and NeuPro-M NPUs into ALi's VDSS platform. The NeuPro-Nano NPU is designed for ultra-low power applications, excelling in always-on audio, voice, vision, and sensing use cases. It supports transformer models and enables efficient execution of small language models (SLMs) and other emerging AI workloads at the edge. Complementing this, the NeuPro-M NPU offers scalable performance, ranging from 4 to 200 TOPS/core, supporting advanced AI models including transformers, Vision Transformers (ViT), and generative AI [1].

By integrating these NPUs into ALi's VDSS platform, ALi's ASIC design service customers gain access to a flexible and energy-efficient AI acceleration solution, optimized for deep learning inference across a wide range of smart edge applications. The collaboration leverages ALi's proven design expertise and global customer base, combined with Ceva's robust AI software development tools, including the NeuPro-Studio AI SDK. Together, the companies aim to simplify AI SoC development and accelerate time-to-market for Original Design Manufacturers (ODMs), Original Equipment Manufacturers (OEMs), and semiconductor partners [1].

The strategic partnership is expected to drive innovation in the smart edge device market, enabling the development of more intelligent, responsive, and efficient video systems that meet evolving market expectations. ALi Corporation's CEO, Joseph Lien, expressed enthusiasm about the collaboration, stating, "We are excited to partner with Ceva to bring world-class AI capabilities into our video-centric platforms. This collaboration reinforces our strategic move into AI-powered ASIC design and expands our service portfolio, enabling us to better serve our customers' evolving needs" [1].

Ceva's Chief Commercial Officer, Gweltaz Toquet, echoed this sentiment, noting, "Combining our NeuPro-Nano and NeuPro-M NPUs with ALi's system-level design strengths unlocks new possibilities for edge AI innovation, enabling smarter, faster and more responsive video systems that meet the evolving market expectations. We look forward to enabling next-generation intelligent devices together and driving innovation in the smart edge device market" [1].

References:
[1] https://www.ceva-ip.com/press/ali-corporation-and-ceva-announce-strategic-collaboration-to-bring-scalable-edge-ai-to-next-gen-video-platforms/

CEVA and ALi Corporation Collaborate on Edge AI for Next-Gen Video Platforms

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