Broadcom Trading Volume Drops 30.8% to Ninth Place Despite AI Chip Innovations

On March 25, 2025, Broadcom (AVGO) experienced a significant drop in trading volume, with a 30.8% decrease from the previous day, totaling 44.18 billion. This decline placed Broadcom at the ninth position in terms of trading volume for the day. The stock price of AVGO also decreased by 1.56%, marking the second consecutive day of decline, with a total decrease of 1.77% over the past two days.

Broadcom has expanded its 200G/lane DSP PHY portfolio with the introduction of two new products, Sian3 and Sian2M, specifically designed for AI/ML cluster connectivity. These new DSPs, along with a comprehensive portfolio of 200G/lane lasers, offer unprecedented levels of power efficiency and cost-effectiveness, addressing the growing demands for connectivity in AI/ML clusters.

The Sian3 chip, built on 3-nanometer process technology, represents a significant upgrade over the previous Sian2 chip, which utilized 5-nanometer process technology. The Sian2M is a specialized version of Sian2, optimized for lower power consumption in multi-mode fiber applications. Both chips operate with pulse amplitude modulation (PAM-4) and a digital signal processor (DSP) in a physical layer (PHY) transceiver, ensuring seamless data transmission at speeds of 200 gigabits per second per lane.

Vijay Janapaty, Vice President and General Manager of Broadcom’s Physical Layer Products Division, highlighted that the 3nm Sian3 achieves over 20% power reduction for 1.6T optical modules. Meanwhile, Sian2M, with integrated VCSEL (vertical-cavity surface-emitting laser) drivers and 200G VCSELs, enhances cost and power efficiency for short-reach links.

Broadcom’s latest innovations in power efficiency are crucial for companies scaling AI infrastructure, where optimizing computing clusters and data transmission is essential. These advancements ensure better scalability and energy efficiency in AI workloads, positioning Broadcom as a leader in AI networking solutions.

Broadcom is offering early access samples of Sian3 and Sian2M to select customers, with mass production of Sian3 expected to begin in the third quarter of this year. This move solidifies Broadcom’s leadership in AI networking solutions and underscores its commitment to driving innovation in the industry.