Black Sesame, Intel Partner for Advanced Cockpit-Driving Platform

Black Sesame Intelligent and Intel have announced a strategic partnership to develop a cockpit-driving fusion platform. This collaboration aims to integrate the strengths of both companies in the fields of intelligent cockpit chips and advanced driver-assistance systems (ADAS). The platform is designed to provide a high-performance, cost-effective, and reliable solution for global automotive manufacturers, catering to a range of driving scenarios from L2+ to L4.

The platform combines Intel's expertise in intelligent cockpit chips and high-performance automotive discrete graphics cards with Black Sesame Intelligent's HuaShan A2000 family of full-scene cognitive assistant driving chips and the WuDang C1200 family of cross-domain fusion computing chips. This integration is supported by jointly developed software, enabling a breakthrough in both cockpit experience and assisted driving performance. The platform offers an open, flexible, and highly scalable design, allowing for a single design to be adapted to various vehicle models, simplifying the development process and enhancing user experience.

Black Sesame Intelligent's CEO, Dan Jizhang, emphasized the company's commitment to meeting market demands. He highlighted that the collaboration with Intel leverages both companies' strengths in ADAS SoC and cockpit SDV SoC, providing a high-performance and cost-effective platform with extensive scalability. This platform is designed to meet the needs of various driving scenarios, from L2+ to L4.

Intel's China OEM&ODM Sales Director, Guo Wei, noted that the partnership with Black Sesame Intelligent will leverage Intel's long-term investments in software-defined vehicles. He expressed the hope that the cockpit-driving fusion platform will provide users with advanced assisted driving and intelligent cockpit capabilities, ensuring safety and an enhanced user experience through superior computing power and efficiency.

In addition to the cockpit-driving fusion platform, Black Sesame Intelligent also unveiled the industry's first "safe intelligent base" solution. This solution, based on the WuDang C1200 family of cross-domain fusion chips, represents a significant step towards integrating electronic and electrical architectures. It addresses safety and cost challenges in cross-domain integration, supporting seamless upgrades for intelligent cockpit and assisted driving functions across entry-level to flagship vehicle models.

The safe intelligent base solution has already been recognized by multiple international leading enterprises and is entering the mass production stage. This development underscores the growing trend of collaboration between technology companies and automotive manufacturers to create advanced, integrated solutions. By leveraging their respective strengths, Intel and Black Sesame Intelligent are poised to deliver a cutting-edge platform that meets the evolving needs of the automotive industry. This partnership not only highlights the importance of technological innovation in the automotive sector but also demonstrates the potential for cross-industry collaboration to drive progress and innovation.