DEEPX has partnered with Baidu to advance on-device AI solutions in industries such as drones, robotics, and OCR. The collaboration will integrate DEEPX's low-power AI semiconductor technology with Baidu's open-source deep learning framework, PaddlePaddle. This will enhance the practical applicability of AI models and expand their reach globally.
DEEPX, a leading innovator in low-power on-device AI chips, has formed a strategic partnership with Baidu to enhance the accessibility and implementation of AI solutions across various industries. This collaboration involves integrating DEEPX's AI semiconductor technology with Baidu's PaddlePaddle, China's first open-source deep learning framework. The partnership aims to accelerate the development and deployment of AI models, particularly in areas like drones, robotics, and optical character recognition (OCR).
DEEPX's innovations, including the DX-M1 chip, will be utilized to optimize power efficiency and performance in edge computing environments. This initiative is expected to facilitate the broader adoption of AI technologies globally, supporting the integration of advanced AI functionalities in industrial settings. The collaboration will also extend to other areas such as autonomous driving, smart cities, and more, leveraging Baidu's extensive ecosystem and DEEPX's cutting-edge technology.
In other market news, Advanced Micro Devices (AMD) was a notable mover up 5.7% and ended the day at $172.40. The company announced robust earnings results for Q2 2025 on Tuesday, with a significant increase in sales and net income compared to the previous year. Meanwhile, Semiconductor Manufacturing International (SMIC) lagged, down 8.2% to end the day at HK$48.66. Two days ago, the company reported second-quarter earnings with sales of USD 2,209.07 million and a net income of USD 132.49 million.
The partnership between DEEPX and Baidu marks an important turning point in the rapid spread of DEEPX's AI semiconductor technology to global industrial sites. DEEPX will utilize Samsung Foundry's next-generation AI semiconductor "DX-M2" based on 2nm process to validate a prototype to run Baidu's large AI model "ERNIE-4.5-VL-28B-A3B" (MoE-based). Baidu PaddlePaddle and ERNIE Team have proposed to jointly exhibit DEEPX at the 2025 Shenzhen (International) Artificial General Intelligence Conference in Shenzhen at the end of August, and will also conduct on-site demonstrations and joint marketing to global customers.
DEEPX's CEO, Lokwon Kim, stated, "Our partnership with Baidu marks an important turning point in the rapid spread of DEEPX's AI semiconductor technology to global industrial sites. We will strengthen our competitiveness in the global AI market through practical productization based on the PaddlePaddle and ERNIE Ecosystem and various industrial collaborations."
References:
[1] https://au.finance.yahoo.com/news/week-ai-chips-deepx-baidu-113740419.html
[2] https://finance.yahoo.com/news/week-ai-chips-deepx-baidu-113740419.html
[3] https://finance.yahoo.com/news/deepx-baidu-form-ai-ecosystem-070000057.html
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