Applied Materials Gains 1.26% on $1.83B Volume Ranks 35th in Liquidity Amid BESI Takeover Hopes

Market Snapshot

Applied Materials (AMAT) rose 1.26% on March 13, 2026, with a trading volume of $1.83 billion, ranking 35th in terms of liquidity among listed stocks. The gain followed a surge in market speculation surrounding potential strategic moves involving the company, including takeover interest in BE Semiconductor (BESI), a key player in advanced chip-packaging technology. The stock’s performance aligns with broader investor optimism about its position in the AI-driven semiconductor supply chain, despite ongoing geopolitical uncertainties that could complicate cross-border deals.

Key Drivers

Applied Materials’ stock movement was primarily fueled by renewed speculation about its potential acquisition of BE Semiconductor Industries (BESI), a Dutch chip-packaging equipment maker. Multiple sources, including Reuters and Bloomberg News, reported that AMAT and Lam Research (LRCX) have expressed interest in acquiring BESI, which specializes in hybrid bonding technology—a critical enabler for advanced AI and high-performance computing chips. BESI’s shares surged over 10% on the news, reaching a record high, while AMAT’s stake in the company, acquired at 9% in April 2025, has positioned it as a strategic contender. Analysts note that hybrid bonding, which directly links chips using copper-to-copper connections, is a bottleneck technology for the semiconductor industry, making BESI a highly sought-after asset.

The strategic significance of BESI’s technology lies in its ability to address the growing demand for advanced packaging solutions. As AI and HPC applications drive the need for faster data transfer and lower power consumption, hybrid bonding has emerged as a critical differentiator. AMAT’s existing partnership with BESI since 2020 to commercialize this technology underscores its long-term commitment. The company’s acquisition of a 9% stake last year was already seen as a precursor to a potential full takeover, with analysts like Degroof Petercam’s Michael Roeg suggesting shareholders expect AMAT to eventually consolidate the firm. This narrative has bolstered investor confidence, particularly as BESI’s market valuation has grown to 14 billion euros ($16.2 billion), reflecting its pivotal role in the sector.

Another contributing factor to AMAT’s positive momentum was its 15% quarterly dividend increase, raising the payout to $0.53 per share. This move, announced on March 13, reinforced the company’s commitment to shareholder returns and signaled strong free-cash-flow generation. The dividend hike, the ninth consecutive annual increase, aligns with AMAT’s broader strategy to reward investors amid a competitive M&A landscape. While the direct impact of the dividend on the stock price was modest compared to takeover speculation, it provided additional support to sentiment, particularly in a market where institutional investors prioritize income-generating assets.

However, the potential acquisition faces hurdles, including geopolitical risks. The U.S.-EU tensions over Greenland-related policies and national security reviews in the Netherlands could delay or complicate the deal. BESI’s operations in China and its strategic technology make it a sensitive target for foreign bidders. Despite these challenges, AMAT and Lam Research have continued discussions, with both companies reportedly navigating regulatory complexities. The pause in talks earlier this year, triggered by geopolitical tensions, highlights the fragility of the deal’s timeline but has not dampened investor enthusiasm, as the underlying demand for advanced packaging remains robust.

In summary, Applied Materials’ 1.26% gain reflects a combination of strategic positioning in the AI semiconductor ecosystem, a strong dividend policy, and market speculation about its potential acquisition of BESI. While regulatory and geopolitical risks persist, the company’s deepening partnership with BESI and its stake in hybrid bonding technology position it as a key player in the evolving chip-packaging landscape. Investors will likely remain focused on the outcome of ongoing M&A discussions and the broader adoption of advanced packaging solutions in the AI era.