Apple’s Vision Pro 2: A Strategic Leap with M5 Chip Powerhouse and VisionOS Innovations
1min read Apple's forthcoming release of the second-generation Vision Pro headset is piquing interest as industry insiders, led by Mark Gurman, suggest a potential launch window between the fall of 2025 and spring 2026. This anticipated release aligns closely with previous market expectations, further reinforcing the tech giant's strategic roadmap.
Initially, the focus has shifted from Apple's plans to introduce a more affordable Vision headset. Supply chain analyst Ming-Chi Kuo highlighted a significant delay in this endeavor, with the cost-effective model now expected after 2027. This pivot allows Apple to dedicate resources and innovation efforts to the second iteration of Vision Pro, which promises to bring notable advancements.
Central to the Vision Pro 2's enhancements is a transition from the M2 processor of the first model to the upcoming M5 chip. This upgrade aims to substantially boost performance, an essential step given the swift progression from M2 to M4 chips since the launch of the original Vision Pro. To stay competitive, Apple is poised to integrate the M5 chip simultaneously across this headset and new Mac computers.
Regarding design, Gurman reports that the second-generation Vision Pro is likely to mirror the aesthetics of its predecessor. He notes, however, that the transformative changes lie within its internal components, particularly the processing capabilities. While the exterior may remain familiar, these under-the-hood enhancements signify a leap forward for Apple’s headset line.
Additionally, Apple continues to expand its visionOS ecosystem with new features. The latest version, visionOS 2.2, introduces extended Mac display options, including ultra-wide screen support. Gurman underscores the significance of these capabilities as potential game-changers for the Vision Pro. To maintain its edge in the competitive market, Apple must continuously innovate in software to complement its hardware developments.