Apple and Samsung Forge New AI Era with Revolutionary iPhone Chip Design
1min read Apple is once again shaking up the tech industry, unveiling its latest generation of AI chips that promise to redefine the performance standards of smart devices. The tech giant has partnered with Samsung Electronics to develop a new low-power LPDDR DRAM packaging, aimed at bolstering the AI capabilities of its iPhones.
Currently, Apple employs a Package on Package (PoP) solution for iPhones, a method that has been in use since the iPhone 4 was launched in 2010. While this design helps keep the devices compact, it imposes limitations on memory bandwidth and data transfer speeds, subsequently forming a bottleneck for AI applications.
To overcome these challenges, Apple plans to adopt a disaggregated LPDDR DRAM packaging by 2026. This approach, which separates the DRAM from the System on Chip (SoC), intends to enhance data transmission rates and parallel data channels by increasing the number of I/O pins. It also promises better thermal performance, significantly improving memory bandwidth and the AI capabilities of iPhones as a result.
Notably, Apple has previously used similar disaggregated packaging techniques in its Mac and iPad SoCs but later shifted to the memory-on-processor (MOP) solution to lower latency and power consumption. Samsung is further exploring the application of LPDDR6-PIM technology for iPhone DRAM, which boasts two to three times the data transfer speed and bandwidth of the previous LPDDR5X, specifically designed for on-device AI.
This technological advancement is part of Apple’s strategic efforts to keep pace with emerging AI trends and further solidify its market presence. By pushing the boundaries of AI chip technology, Apple aims to maintain its competitive edge in a rapidly evolving tech world.