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Amkor Technology Announces Groundbreaking of $7 Billion Semiconductor Packaging and Test Campus in Arizona
ByAinvest
Sunday, Oct 12, 2025 3:08 pm ET1min read
Amkor Technology has broken ground on a new semiconductor packaging and test campus in Arizona, with an expanded investment of $7 billion. The campus will offer 750,000 square feet of cleanroom space and up to 3,000 jobs. The project is supported by the Trump Administration's CHIPS for America Program and will be the first US-based high-volume advanced packaging facility. The campus will serve customers including Apple and NVIDIA, and feature smart factory technologies and scalable production lines.
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