Aixtron Delivers 100th G10-SiC System, Cementing Market Leadership in SiC Epitaxy Production

Aixtron has shipped its 100th G10-SiC system, marking strong market demand for its epitaxy batch technology since its launch three years ago. The delivery to a European power device and system maker supports the ramp-up of 200mm SiC epitaxy production capacity. The G10-SiC system features a unique multi-wafer configuration, high throughput, and superior epitaxial film quality and yield, making it a key driver of the global electrification of society.

Wolfspeed, Inc. (NYSE: WOLF) has made significant strides in the silicon carbide (SiC) materials market with the commercial release of its 200mm SiC wafers and epitaxy products. The company announced on September 12, 2025, that it is now offering both 200mm SiC wafers and 200mm SiC epitaxy for immediate qualification, marking a significant advancement in its transition from silicon technology to SiC. These products feature improved parametric specifications, including a 350µm thickness with enhanced doping and thickness uniformity, designed to boost MOSFET yields and accelerate time-to-market for device manufacturers Wolfspeed launches 200mm silicon carbide wafers for commercial use^[1].

The expanded wafer diameter represents a substantial development in Wolfspeed's efforts to transition the industry from silicon to silicon carbide technology. The company's Chief Business Officer, Dr. Cengiz Balkas, emphasized that the technological advancements developed for the 200mm products are also being applied to improve their 150mm SiC materials offerings. This move comes as silicon carbide is increasingly adopted in power electronics for automotive, renewable energy, and industrial applications due to its superior efficiency compared to traditional silicon.

In addition to this technological milestone, Wolfspeed has also made significant financial progress. The company received court approval for its Plan of Reorganization and expects to emerge from Chapter 11 bankruptcy protection within the next several weeks. The restructuring plan aims to reduce debt by approximately 70%, equating to about $4.6 billion, through a creditor-backed process. This plan has the support of over 97% of senior secured notes and over 67% of outstanding convertible notes holders. Furthermore, Wolfspeed has appointed Gregor van Issum as its new Chief Financial Officer, effective September 1, 2025. Van Issum, with over 20 years of experience in the semiconductor industry, will succeed Kevin Speirits, the Interim CFO. These developments are part of Wolfspeed's strategy to reduce its annual cash interest payments by approximately 60% and complete its restructuring by the end of the third quarter of 2025 Wolfspeed launches 200mm silicon carbide wafers for commercial use^[1].

These recent developments underscore Wolfspeed's commitment to innovation and financial stability, positioning the company as a key player in the global electrification of society.