Adeia and UMC Expand Partnership in Hybrid Bonding Technologies for Advanced Packaging Solutions

Adeia and UMC have expanded their long-term collaboration in hybrid bonding technologies, with UMC gaining access to Adeia's semiconductor portfolio. The agreement extends their collaboration into future generations of 3D integration and advanced packaging solutions. Adeia's IP portfolio includes innovations in hybrid bonding, advanced packaging, and semiconductor processing technologies, enabling tighter interconnect pitch, improved power efficiency, and increased reliability.