Lorentz, NVIDIA Present Chip-Level EM Extraction at TSMC OIP

생성자Ainvest News검토자David Feng
2026년 9월 14일 월요일 오전 11:43 ET1분 읽기
NVDA--
TSM--
Lorentz Solution and NVIDIANVDA-- will present at TSMCTSM-- OIP, showcasing automated 3D EM extraction and sign-off for ultra-high-speed silicon photonics and IC/3DIC designs. Lorentz's PeakView xLEM flow extends its 3D EM leadership from design to full-chip EM sign-off, delivering complete verification for today's and next-generation AI, photonics, and IC/3DIC designs. The joint presentation highlights the importance of chip-level EM sign-off for multi-terabit data rates and the role of PeakView xLEM in capturing critical inductive effects, EM isolation, and lossy signal propagation.
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