GSME Joins TSMC's OIP Value Chain Alliance in North America

GS Microelectronics US has joined TSMC's Open Innovation Platform Value Chain Alliance as a member partner in North America. This partnership aims to accelerate seamless growth and advanced silicon design innovation from prototype to high-volume production. GSME has a proven track record of integrating design enablement building blocks with solutions from the OIP ecosystem partners, delivering comprehensive ASIC services across the entire IC value chain. The collaboration comes during GSME's period of rapid international scaling, backed by Series B funding from Maverick Silicon.