Visakhapatnam's Bhogapuram Airport Construction on Schedule for June 2026 Completion

Union Minister K. Rammohan Naidu reviews Bhogapuram airport construction, stating it is progressing as scheduled and will be ready by June 2026. 86% of the work has been completed, with runway and terminal buildings almost ready. The airport is expected to spur economic activity and increase air passenger numbers from 32.4 lakhs to 60 lakhs per year. Road widening and metro corridor projects are also proposed to facilitate traffic.

Union Minister K. Rammohan Naidu recently inspected the Bhogapuram airport construction site, confirming that 86% of the work is complete. The minister praised the construction company, GMR, for maintaining steady progress despite challenges, including the rainy season. The airport is expected to be operational by June 2026, with the runway and terminal buildings almost ready Bhogapuram airport 86% complete, opening 2026^[1].

The Bhogapuram airport is anticipated to significantly boost economic activity in the region. It is projected to increase air passenger numbers from 32.4 lakhs to 60 lakhs per year. To facilitate traffic and enhance connectivity, road widening and metro corridor projects are proposed. The minister also mentioned that a Detailed Project Report (DPR) is being prepared for the beach corridor, aiming to improve connectivity between Vizag and Kochi Bhogapuram airport 86% complete, opening 2026^[1].

In addition to the airport development, Andhra Pradesh is pushing its electronics manufacturing ambitions. The state government has approved India’s largest Printed Circuit Board (PCB) manufacturing facility at Menakuru village in Naidupeta by Syrma Strategic Electronics (SSEPL). This project, the first under the state’s Electronics Components Manufacturing and Supply (ECMS) Policy (2025–30), involves an investment of Rs 1,076 crore and is expected to generate 1,011 jobs Andhra Pradesh clears Syrma's ₹1,593 cr projects under electronics push^[2].

The PCB facility will produce single, multilayer, high-density interconnect (HDI), and flexible PCBs, which are critical components for various sectors such as consumer electronics, automotive, telecom, and renewable energy. The project aims to reduce India’s import dependence on PCBs, a significant gap in the electronics value chain. Additionally, two more projects from the Syrma Group have been approved, including a Copper Clad Laminate (CCL) facility and an Electronics Manufacturing Services (EMS) facility Andhra Pradesh clears Syrma's ₹1,593 cr projects under electronics push^[2].

These developments highlight Andhra Pradesh’s strategic focus on infrastructure and electronics manufacturing, positioning the state as a key contributor to India’s global electronics ambitions. The state’s proactive policy offers incentives such as capital subsidies, power benefits, and land at concessional rates to attract early investors.