UMC Unveils 55nm BCD Platform for Enhanced Power Efficiency in Mobile Devices and Automotive Applications

United Microelectronics Corporation (UMC) has introduced a 55nm Bipolar-CMOS-DMOS (BCD) platform to improve power efficiency in smartphones, consumer electronics, and automotive applications. The platform offers three solutions: Non-Epitaxy, Epitaxy, and Silicon-on-Insulator processes, with ultra-thick metal, embedded flash, and resistive random-access memory technologies for enhanced performance and functionalities. The 55nm BCD platform is designed to address the growing complexity of power management in electronic devices, enabling greater flexibility and reliability in power circuit designs.