TSMC's CoWoS Capacity Overwhelmed by Nvidia, Google, Amazon, and MediaTek Demand

Taiwan Semiconductor Manufacturing Co. (TSMC) is facing overwhelming demand for its advanced packaging technologies, with companies like Nvidia, Google, Amazon, and MediaTek racing to secure capacity for next-generation AI chips. TSMC is reportedly turning to partners to ensure timely delivery of silicon interposers and other components, with suppliers like ASE Technology benefiting from spillover demand. Despite speculation about potential defections, TSMC's deep customer relationships and integrated manufacturing services make large-scale defections unlikely.