Teradyne Unveils Magnum 7H: Next-Gen Memory Tester for High Bandwidth Memory Devices

Teradyne has launched the Magnum 7H, a next-generation memory tester for high bandwidth memory devices, including HBM2E, HBM3, and HBM4. The tester delivers high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale. It supports a wide range of HBM versions and offers comprehensive test coverage from base-die wafer test to memory core test and burn-in. The Magnum 7H is engineered to meet the demands of testing high-performance, generative AI servers.

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, has introduced the Magnum 7H, a next-generation memory tester designed to meet the rigorous demands of testing high bandwidth memory (HBM) devices integrated with GPUs and accelerators in high-performance, generative AI servers. The Magnum 7H is engineered to deliver high-parallelism, high-speed, and high-accuracy testing for HBM stacked die at scale.

The Magnum 7H supports a wide range of HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It offers comprehensive test coverage from base-die wafer test to memory core test and burn-in, ensuring the quality and reliability of HBM devices. Additionally, the Magnum 7H supports testing of pre-singulated HBM devices at the Known-Good-Stack-Die (KGSD) or Chip-on-Wafer level with traditional probers and probe cards, as well as post-singulated HBM with new bare-die probers/handlers for improved device quality.

The Magnum 7H delivers enhanced device quality with superior DPS response time, resulting in higher device yield. It is ideally suited for testing HBM stacks that contain both logic base dies and DRAM dies. The tester offers high-speed memory testing with a flexible algorithmic pattern generator (APG) and logic testing with the Logic Vector Memory (LVM) option. The Fail List Streaming (FLS) feature ensures high-speed error capture for both memory and logic testing.

The Magnum 7H can test current HBM3/3E and next-generation HBM4/4E devices up to 4.5Gbps. Its high parallelism capability, configurable for up to 9,216 digital pins and 2,560 power pins, enables superior touchdown efficiency at probe and results in 1.6x increased throughput in mass production environments.

The increasing demands for higher performance and efficiency in AI and cloud infrastructure applications are driving demand for HBM. Teradyne’s Magnum 7H is a next-generation memory tester engineered to test both today and tomorrow’s HBM devices with high parallelism, speed, and accuracy, across the entire manufacturing process.

For more information about the Magnum 7H and its capabilities, visit [Teradyne's website](https://www.teradyne.com/products/magnum-7h/).

References:
[1] https://www.marketscreener.com/news/teradyne-unveils-magnum-7h-the-next-generation-memory-tester-for-high-bandwidth-memory-devices-ce7c5edadf8cf522
[2] https://www.morningstar.com/news/business-wire/20250804458862/teradyne-unveils-magnum-7h-the-next-generation-memory-tester-for-high-bandwidth-memory-devices
[3] https://www.businesswire.com/news/home/20250804458862/en/Teradyne-Unveils-Magnum-7H---The-Next-Generation-Memory-Tester-for-High-Bandwidth-Memory-Devices