Supermicro expands NVIDIA Blackwell system portfolio with new liquid-cooled and air-cooled options.

Supermicro has expanded its NVIDIA Blackwell system portfolio with a 4U DLC-2 liquid-cooled HGX B200 system and an air-cooled 8U front I/O system. The new systems aim to streamline deployment, management, and maintenance of AI infrastructure, supporting NVIDIA HGX B300 platforms and enabling up to 40% data center power savings. The air-cooled system offers enhanced memory configuration flexibility, density, and cold aisle serviceability.

San Jose, California — Supermicro (NASDAQ: SMCI) has expanded its NVIDIA Blackwell system portfolio with the introduction of a 4U DLC-2 liquid-cooled NVIDIA HGX B200 system and an 8U front I/O air-cooled system. These new systems are designed to streamline the deployment, management, and maintenance of AI infrastructure, supporting NVIDIA HGX B300 platforms and enabling significant data center power savings.

The 4U DLC-2 liquid-cooled NVIDIA HGX B200 system offers up to 40% data center power savings, 40% reduced water consumption, and up to 98% system heat capture. It features dual-socket Intel Xeon 6700 Series processors, support for 32 DIMMs with up to 8TB capacity, and includes 8 NVIDIA ConnectX-7 NICs and 2 NVIDIA Bluefield-3 DPUs. The system is optimized for NVIDIA HGX B200 8-GPU configuration with 1.4TB of HBM3e GPU memory per system, delivering up to 15x faster real-time inference and 3x faster training compared to the Hopper generation of GPUs.

The 8U front I/O air-cooled system shares similar specifications but provides enhanced memory configuration flexibility, density, and cold aisle serviceability. It features a compact 8U form factor with a reduced-height CPU tray while maintaining the full 6U-height GPU tray to maximize air-cooling performance. This system is designed to serve AI factories without liquid-cooling infrastructure, offering a streamlined solution for large-scale AI training and cloud-scale inference workloads.

Both systems are built upon Supermicro's Building Block architecture, allowing customers to choose their most optimized CPUs, memory, networking, storage, and cooling configuration. The new front I/O systems with dual-socket CPUs supporting up to 350W Intel® Xeon® 6 6700 Series processors deliver high performance and efficiency for a wide range of AI workloads.

Supermicro's new front I/O B200 systems equip enterprises to deploy and scale AI at unprecedented speed, delivering breakthrough innovation, efficiency, and operational excellence. The systems are designed to support NVIDIA's latest HGX B300 platforms, allowing for easy front I/O access, simplifying cabling, improving thermal efficiency, and reducing operational expenses (OPEX).

Supermicro's extensive portfolio now offers precisely optimized NVIDIA Blackwell solutions to a diverse range of AI infrastructure environments, whether deploying into an air- or liquid-cooled facility. The company's commitment to delivering first-to-market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure is evident in these new solutions.

References:
[1] https://www.stocktitan.net/news/SMCI/supermicro-expands-its-nvidia-blackwell-system-portfolio-with-new-hy5w607tuets.html
[2] https://www.prnewswire.com/news-releases/supermicro-expands-its-nvidia-blackwell-system-portfolio-with-new-direct-liquid-cooled-dlc-2-systems-enhanced-air-cooled-models-and-front-io-options-to-power-ai-factories-302526521.html