Supermicro Expands NVIDIA Blackwell Portfolio with New Liquid-Cooled and Air-Cooled Systems

Supermicro expands its NVIDIA Blackwell system portfolio with new direct liquid-cooled (DLC-2) systems, enhanced air-cooled models, and front I/O options. The DLC-2 4U front I/O liquid-cooled system provides up to 40% data center power savings, while the 8U front I/O air-cooled system delivers enhanced system memory configuration flexibility, density, and cold aisle serviceability.

Supermicro, Inc. (NASDAQ: SMCI), a leading Total IT Solution Provider for AI, HPC, Cloud, Storage, and 5G/Edge, has recently expanded its NVIDIA Blackwell system portfolio with new direct liquid-cooled (DLC-2) systems, enhanced air-cooled models, and front I/O options. These additions are designed to optimize data center efficiency and scalability, particularly for AI-focused workloads.

The new DLC-2 4U front I/O liquid-cooled system offers up to 40% data center power savings, significantly reducing operational expenses and enhancing thermal efficiency. This system is tailored to meet the demands of high-density computing environments, featuring advanced cooling architecture that captures up to 98% of system heat [1].

In addition to the liquid-cooled system, Supermicro has introduced an 8U front I/O air-cooled system. This model provides enhanced system memory configuration flexibility, density, and cold aisle serviceability, making it ideal for large-scale AI training and inference deployments. The new system includes 32 DIMM slots, which offer greater memory expansion capabilities, eliminating CPU-GPU bottlenecks and optimizing large workload processing [2].

Supermicro's Building Block architecture enables the rapid delivery of customized solutions, allowing customers to choose their preferred CPUs, memory, networking, storage, and cooling configurations. The new front I/O systems are built upon proven solutions for large-scale AI training and inference, addressing major pain points in deployment, such as networking, cabling, and thermals.

The introduction of these new systems aligns with the growing demand for optimized AI infrastructure. According to Charles Liang, CEO and President of Supermicro, "Supermicro's DLC-2 enabled NVIDIA HGX B200 system leads our portfolio to achieve greater power savings and faster time to online for AI Factory deployments. Our Building Block architecture enables us to quickly deliver solutions exactly as our customers request" [1].

These innovations are part of Supermicro's commitment to delivering cutting-edge AI solutions that drive operational efficiency and innovation. As AI continues to transform industries, these advancements in cooling and front I/O options will be crucial in supporting the scalability and performance demands of modern data centers.

References:
[1] https://simplywall.st/stocks/us/semiconductors/nasdaq-mrvl/marvell-technology/news/why-marvell-technology-mrvl-is-up-after-announcing-expanded
[2] https://ir.supermicro.com/news/news-details/2025/Supermicro-Expands-Its-NVIDIA-Blackwell-System-Portfolio-with-New-Direct-Liquid-Cooled-DLC-2-Systems-Enhanced-Air-Cooled-Models-and-Front-IO-Options-to-Power-AI-Factories/default.aspx