Smartkem and Manz Asia Collaborate on Advanced Packaging Solutions for AI Chips at SEMICON SEA 2025

Smartkem and Manz Asia collaborate to demonstrate advanced inkjet metallization for computer and AI chip packaging solutions at SEMICON SEA 2025 in Singapore. The partnership aims to address the growing demand for AI chip packaging and leverage Smartkem's UV curable dielectric layer chemistry and Manz Asia's inkjet printing technology. The collaboration has the potential to enable large area panel chip packaging and is expected to grow to approximately $600 million in 2030 with a 27% compound annual growth rate from 2024.