SK Hynix Completes HBM4 Development, Sets Up Production System

SK Hynix has completed the development of HBM4, the latest generation of high-bandwidth memory, with a production system set up. HBM4 offers higher speed and performance than conventional DRAMs, making it in high demand from AI applications, with Nvidia being SK Hynix’s key customer. Compared to HBM3E, HBM4 has double the number of I/Os, twice the bandwidth, and 40% increased power efficiency.

SK Hynix, a leading South Korean semiconductor company, has announced the completion of the development of HBM4, the latest generation of high-bandwidth memory (HBM). This breakthrough comes with the establishment of a mass production system for the chips, marking a significant advancement in the memory technology landscape.

HBM4, which stands for High Bandwidth Memory, is designed by stacking DRAM vertically, providing higher speed and performance compared to conventional DRAMs. This technology is particularly in high demand from AI applications, with Nvidia being SK Hynix’s key customer for these memory chips SK Hynix completes development of HBM4^[1].

The new generation of HBM offers several enhancements over its predecessor, HBM3E. HBM4 doubles the number of input-output channels to 2,048, effectively doubling the bandwidth. Additionally, power efficiency has been improved by over 40 percent, making it a more energy-efficient solution for data centers and AI customers SK hynix completes development of HBM4 and mass production system^[2]. SK Hynix has also managed to increase the maximum speed of HBM4 to 10 gigabits per second, surpassing the 8 gigabits per second standard set by JEDEC.

The development of HBM4 involved the use of SK Hynix's latest Gen 5 10-nanometer DRAMs and an advanced mass reflow molded underfill (MR-MUF) technique. This technique helps to dissipate heat effectively and minimize chip warping, ensuring the stability and reliability of the memory chips during mass production SK hynix completes development of HBM4 and mass production system^[2].

Kim Ju-seon, president and head of AI infrastructure at SK Hynix, stated, "HBM4, the first to officially enter mass production globally, is a breakthrough product that addresses critical technological challenges in the AI era. We will continue to supply the highest-quality, high-performance memory products the market demands as we evolve into a full-stack AI memory provider."

This development is expected to significantly impact the AI memory market, with potential performance improvements of up to 69 percent for AI services. By adopting HBM4, data centers can eliminate data bottlenecks and reduce power costs SK hynix completes development of HBM4 and mass production system^[2].

SK Hynix's commitment to innovation and customer satisfaction is evident in this latest achievement. The company's focus on performance, energy efficiency, and reliability positions it as a key player in the AI memory market.