NVIDIA Boosts TSMC's 3nm Capacity to Meet AI Chip Demand with Blackwell Platform

NVIDIA CEO Jensen Huang has requested TSMC to increase 3nm wafer production capacity by 50% to meet demand for its Blackwell AI chips. TSMC's monthly output is expected to rise to approximately 160,000 wafers, with 35,000 dedicated to NVIDIA. The AI boom is driving capacity expansions across the supply chain, with memory suppliers SK Hynix, Samsung, and Micron increasing production. NVIDIA has praised TSMC as a global leader and emphasized their 30-year partnership.