Northrop Grumman Opens Microelectronics Center to External Defense Firms for Secure Production

Northrop Grumman has opened up its Microelectronics Center to external aerospace and defense firms, allowing for secure production of defense microelectronics on US soil. The open-access model enables external entities to design, manufacture, package, and test microelectronics domestically for commercial and defense applications. This move aims to strengthen the resilience of America's semiconductor industry and supply chain.

Northrop Grumman has announced that its Microelectronics Center is now open to external aerospace and defense companies, providing access to its three U.S. government-accredited semiconductor manufacturing facilities. This move aims to expand secure domestic production of defense microelectronics and strengthen the resilience of America's semiconductor industry and supply chain Northrop Grumman opens semiconductor facilities to strengthen U.S. microelectronics^[1].

The open-access model allows external entities, including commercial businesses, academia, the U.S. Government, and federally funded research centers, to design, manufacture, package, and test microelectronics in the United States. Additionally, it enables direct purchase of semiconductor products and components through an online storefront Northrop Grumman opens semiconductor facilities to strengthen U.S. microelectronics^[1].

Vern Boyle, vice president of the Northrop Grumman Microelectronics Center, stated: "By opening our defense-grade manufacturing facilities to partners, Northrop Grumman is expanding and strengthening the resilience of America’s semiconductor industry and supply chain. We are providing partners with unprecedented access to design and develop domestic chips as well as the ability to directly purchase from us, enhancing collaboration across the broader defense industrial base" Northrop Grumman opens semiconductor facilities to strengthen U.S. microelectronics^[1].

The Microelectronics Center comprises two U.S. government-accredited semiconductor foundries in California and Maryland, alongside an advanced packaging facility in Florida. The Florida site carries out 100mm-300mm wafer bumping, probing, and dicing, enabling the integration of multiple smaller chips into single, more powerful electronic packages Northrop Grumman opens semiconductor facilities to strengthen U.S. microelectronics^[1].

Unlike traditional methods that place chips side by side, advanced packaging stacks them into three-dimensional structures with high-density connections. This capability is regarded as critical for next-generation devices, particularly as 98% of advanced packaging needs are currently met offshore, exposing supply chains to global risks Northrop Grumman opens semiconductor facilities to strengthen U.S. microelectronics^[1].

Northrop Grumman is among the few defense companies able to package chips domestically, producing millions annually to support U.S. defense and commercial systems. The company states this ensures a sustainable American supply chain, strengthening national defense infrastructure Northrop Grumman opens semiconductor facilities to strengthen U.S. microelectronics^[1].

With nearly 100,000 employees and more than 30 million square feet of manufacturing space, Northrop Grumman highlights its capacity and agility to drive innovation at scale. The company says its investment in infrastructure, research and development, workforce, and supply chain aims to meet both present and future national security needs Northrop Grumman opens semiconductor facilities to strengthen U.S. microelectronics^[1].