Multibeam Secures $31M in Series B Funding for E-Beam Lithography Solutions

Multibeam Corp. has raised $31 million in Series B funds from investors including Onto Innovation, Lam Capital, UMC Capital, and MediaTek Capital. The funds will be used to accelerate the development of Multibeam's next-generation multi-column E-Beam Lithography platform for 300mm wafer and panel-level maskless lithography, as well as to develop applications for advanced packaging and integration of semiconductors. The funding marks the next phase of growth for the EBL leader, which has seen soaring interest from global semiconductor manufacturers for emerging applications enabled by its electron beam-based patterning solution.

Multibeam Corp. has raised $31 million in Series B funds from a group of global investors led by Onto Innovation Inc. (NYSE: ONTO), Lam Capital, UMC Capital, and MediaTek Capital. This funding round, which was oversubscribed, will be used to accelerate the development of Multibeam's next-generation multi-column E-Beam Lithography (EBL) platform for 300mm wafer and panel-level maskless lithography. Additionally, the funds will support the development of applications for advanced packaging and integration of semiconductors to meet the demands of artificial intelligence (AI) and related technologies.

The investment round underscores the strong support Multibeam has garnered from leaders in the semiconductor industry. The company's existing partnerships, such as with EDA leader Synopsys, have been instrumental in its growth. Since shipping its first EBL production system last year, Multibeam has seen a significant increase in interest from global semiconductor manufacturers for emerging applications uniquely enabled by its high-productivity electron beam-based patterning solution.

Multibeam Founder and Chairman, Dr. David K. Lam, expressed gratitude for the new investors, noting that they bring valuable experience and insight to the company. Onto Innovation CEO, Michael Plisinski, highlighted the potential of Multibeam's technology for advanced packaging solutions, particularly in enabling denser interconnects between chips cost-effectively. Audrey Charles, Senior Vice President of Corporate Strategy and Advanced Packaging at Lam Research and President of Lam Capital, emphasized the importance of heterogeneous chip-to-chip integration for delivering lower power, higher performance semiconductors needed for AI compute.

Kris Peng, President of UMC Capital, praised Multibeam's highly flexible lithography tool, which can pattern fine features across full wafers. Brian Hsu, Partner at MediaTek Capital, noted that Multibeam's system enables rapid time to prototype and time to market, facilitating the development of a wide variety of novel and diverse applications.

This Series B funding marks the next phase of growth for Multibeam, positioning it to address the growing demand for advanced semiconductor technologies. The company's differentiated innovations, extendible platform strategy, and expert technology team are well-positioned to meet the evolving needs of the industry.

References:
1. [Multibeam Secures $31 Million in Series B Financing](https://www.morningstar.com/news/globe-newswire/9501751/multibeam-secures-31-million-in-series-b-financing-to-accelerate-global-deployment-of-e-beam-lithography-production-solutions)
2. [Multibeam Secures $31 Million Series B Financing](https://www.nasdaq.com/press-release/multibeam-secures-31-million-series-b-financing-accelerate-global-deployment-e-beam)