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Lightwave Logic announces a reliability breakthrough for its Perkinamine polymer, passing the Telcordia 85/85 test and developing enhanced moisture and oxygen resistance through fourth-generation encapsulation technology. The company's EO polymer materials maintain performance over time, meeting industry requirements for deployment in telecom and datacom infrastructure. Lightwave Logic's process development team has achieved a significant breakthrough with its fourth-generation atomic layer deposition encapsulation material, demonstrating an oxygen transmission rate of 1.4 × 10⁻⁶ g/m²/day.

Lightwave Logic, Inc. (NASDAQ: LWLG), a leading provider of high-performance electro-optic (EO) polymer materials, has announced a significant reliability breakthrough for its Perkinamine™ polymer. The company's latest-generation polymer has successfully passed the rigorous Telcordia GR-468 85/85 environmental stress test, demonstrating exceptional long-term reliability under harsh environmental conditions [1].

The Telcordia GR-468 85/85 test subjects materials to 85°C at 85% relative humidity for 1,000 hours. Lightwave Logic's Perkinamine™ polymer exhibited only a 1.6% average loss in absorbance measurements after 1,000 hours, significantly exceeding the minimum requirements and confirming its robustness against moisture and oxygen [1]. This achievement positions Lightwave Logic's technology for deployment in AI factory scale-out and hyperscaler front-end networking applications, where reliability is paramount.

Additionally, Lightwave Logic's process development team has achieved a breakthrough with its fourth-generation atomic layer deposition (ALD) encapsulation material. This material demonstrated an oxygen transmission rate (OTR) of 1.4 × 10⁻⁶ g/m²/day, approaching the measurement limit of state-of-the-art OTR instrumentation. This performance far exceeds the industry "gold-box" standard of 7 × 10⁻⁶ g/m²/day, representing a significant advancement in protection technology [1].

The company is preparing this fourth-generation encapsulation material for its next-release back-end-of-line (BEOL) Process Design Kit (PDK) for integration into silicon photonics foundries. This move signifies Lightwave Logic's commitment to scalable manufacturing and commercialization, bridging the gap between promising technology and real-world applications in the photonics industry [1].

CEO Yves LeMaitre underscored the significance of these achievements, stating, "Achieving full Telcordia 85/85 certification and improving barrier performance by two orders of magnitude are watershed achievements for our platform. Similar to the trajectory of Organic LEDs, electro-optic polymers are demonstrating that they now meet the reliability requirements for deployment in real-world applications-including AI factory scale-out and hyperscalers front-end networking" [1].

Lightwave Logic's accomplishments build upon its prior industry-leading EO polymer performance and strategic partnerships with foundries for scalable device manufacturing. These milestones are critical components of the company's Stage 1 and 2 design win process with companies actively engaged in its commercial pipeline [1].

References:
[1] https://www.morningstar.com/news/accesswire/1049059msn/lightwave-logic-inc-announces-perkinaminetm-polymer-reliability-breakthrough-passes-telcordia-8585-test-develops-enhanced-moisture-oxygen-resistance-via-fourth-generation-encapsulation-technology