Infinitesima launches three-year development project with ASML to enhance Metron3D 300mm wafer metrology system for cutting-edge applications.

Infinitesima has begun a three-year project to develop the capabilities of its Metron3D 300mm in-line wafer metrology system. The system will be used to optimize metrology solutions for applications such as hybrid bonding, high-NA EUV lithography, and 3D logic device structures. Infinitesima will work with partners including ASML and imec to deliver true 3D process control, critical for enabling the production of future semiconductor devices. The project aims to address the industry's need for detailed 3D metrology information throughout the full structure of features at high throughput and in high-volume manufacturing environments.

Title: Infinitesima Launches Three-Year Project to Enhance Metron3D 300mm In-line Wafer Metrology System

ABINGDON, United Kingdom, July 2, 2025 — Infinitesima Limited, a UK-based leader in advanced metrology solutions for the semiconductor industry, has announced a three-year development project aimed at enhancing the capabilities of its Metron3D 300mm in-line wafer metrology system [1]. The project, which includes partnerships with ASML and imec, seeks to optimize metrology solutions for cutting-edge applications such as hybrid bonding, high-NA EUV lithography, and 3D logic device structures.

The Metron3D system, which features Infinitesima’s Rapid Probe Microscope (RPM™) technology, will be used to address the industry's urgent need for detailed 3D metrology information throughout the full structure of features at high throughput and in high-volume manufacturing environments [1]. The system will be sited at imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, to advance next-generation device development [1].

Infinitesima’s partnership with imec began in 2021, initially focusing on enabling tip-induced nanoscale tomographic sensing using its patented RPM™ for research and failure analysis applications [1]. This new collaboration marks the expansion of the Infinitesima-imec partnership into high-speed, in-line production metrology, supporting the semiconductor industry’s advancing inspection and metrology demands for sub-nanometer features and increasingly complex 3D structures [1].

The project aims to deliver true 3D process control, which is critical for enabling the production of future semiconductor devices. Peter Jenkins, CEO of Infinitesima, stated, “We are delighted to extend our existing collaboration with imec to support the critical metrology challenges of some of the most critical process steps for next-generation semiconductor processes” [1].

Infinitesima's leading position in in-line semiconductor metrology is set to be reinforced through this expanded partnership, supporting the industry's evolution toward smaller and increasingly complex device architectures [1].

References

[1] https://finance.yahoo.com/news/infinitesima-begins-project-further-develop-060000684.html
[2] https://www.globenewswire.com/news-release/2025/07/22/3119157/0/en/Infinitesima-Begins-Project-to-Further-Develop-the-Capabilities-of-the-Metron3D-300-mm-In-line-Wafer-Metrology-System.html