HSBC Expects Advanced Micro Devices to Benefit from Cloud Service Providers Despite Lower AI GPU Revenue Estimate
PorAinvest
sábado, 13 de septiembre de 2025, 9:57 am ET1 min de lectura
AMD--
The rise in TVL from $1.91 billion to $2 billion indicates growing investor confidence in the Sui ecosystem. This growth is likely driven by the increasing demand for the staking service, which locks SUI holdings in smart contracts on the chain, earning staking rewards in return [1]. A higher TVL also reduces the circulating supply and potential selling pressure, which can contribute to a sustainable price rally.
Technically, Sui holds significantly above key moving averages, including the 50-day Exponential Moving Average (EMA) at $3.50, the 100-day EMA at $3.44, and the 200-day EMA at $3.29. These moving averages face a slightly upward slope, reinforcing bullish sentiment. Additionally, a buy signal by the Moving Average Convergence Divergence (MACD) indicator has been sustained since Monday on the daily chart, suggesting that bulls have the upper hand [1].
The bullish outlook is further supported by a potential 22% increase to $4.43, which was previously tested on July 28. A break above the descending trendline in the same daily time frame could extend the uptrend. However, traders should be cautious about the impact of early profit-taking, which could cause a temporary decline and bring the 50-day EMA at $3.50, the 100-day EMA at $3.44, and the 200-day EMA at $3.29 within reach [1].
In conclusion, Sui's strong technical structure and growing DeFi TVL suggest a potential 22% rally to $4.43. However, investors should remain vigilant and consider the impact of early profit-taking and market sentiment.
SUI--
HSBC reiterated a "Buy" rating on Advanced Micro Devices (AMD) but cut its price target to $185 from $200 due to concerns about the average selling price of the M1355 chip. Despite the reduced estimate, HSBC expects AMD to benefit from major cloud service providers testing its M1400 rack solution, diversifying its revenue base. The company's AI GPU business is still 20% above consensus estimates.
Sui (SUI), the Layer-1 token, has shown signs of a strong recovery as its DeFi Total Value Locked (TVL) surpasses $2 billion. According to FXStreet, Sui's price has been holding above $3.62, having surged above $3.70 earlier in the day on Wednesday, September 12, 2025. This upward trend is supported by increasing retail interest, with Sui's futures Open Interest (OI) averaging $1.98 billion on Friday, up from $1.78 billion on August 22 [1].The rise in TVL from $1.91 billion to $2 billion indicates growing investor confidence in the Sui ecosystem. This growth is likely driven by the increasing demand for the staking service, which locks SUI holdings in smart contracts on the chain, earning staking rewards in return [1]. A higher TVL also reduces the circulating supply and potential selling pressure, which can contribute to a sustainable price rally.
Technically, Sui holds significantly above key moving averages, including the 50-day Exponential Moving Average (EMA) at $3.50, the 100-day EMA at $3.44, and the 200-day EMA at $3.29. These moving averages face a slightly upward slope, reinforcing bullish sentiment. Additionally, a buy signal by the Moving Average Convergence Divergence (MACD) indicator has been sustained since Monday on the daily chart, suggesting that bulls have the upper hand [1].
The bullish outlook is further supported by a potential 22% increase to $4.43, which was previously tested on July 28. A break above the descending trendline in the same daily time frame could extend the uptrend. However, traders should be cautious about the impact of early profit-taking, which could cause a temporary decline and bring the 50-day EMA at $3.50, the 100-day EMA at $3.44, and the 200-day EMA at $3.29 within reach [1].
In conclusion, Sui's strong technical structure and growing DeFi TVL suggest a potential 22% rally to $4.43. However, investors should remain vigilant and consider the impact of early profit-taking and market sentiment.

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