GlobalFoundries Unveils 130nm CBIC Platform for High-Performance Applications

GlobalFoundries announced the production release of its 130nm complementary Bi-CMOS (CBIC) platform, the company's highest-performance silicon germanium (SiGe) technology to date. The platform delivers unmatched performance with NPN transistors exceeding 400 GHz ft/fmax and PNP transistors surpassing 200 GHz, making it suitable for various key markets, including smartphones, wireless infrastructure, and industrial IoT.

GlobalFoundries (GF) has announced the production release of its 130nm complementary Bi-CMOS (CBIC) platform, marking a significant advancement in silicon germanium (SiGe) technology. This high-performance platform, developed and manufactured at GF’s facility in Burlington, Vermont, offers unparalleled performance with NPN transistors exceeding 400 GHz ft/fmax and PNP transistors surpassing 200 GHz [1].

The 130CBIC platform is designed to address multiple key markets, including smartphones, wireless infrastructure, optical networking, satellite communications, and industrial IoT. By combining industry-leading transistor performance with a low-mask count process, GF aims to open new avenues of RF innovation for its customers [1].

In the realm of cellular smartphones, the platform enables low-noise amplifiers (LNAs) that reduce current consumption while maintaining ultra-low noise figure, thereby helping to minimize battery drain. In the data center, high-performance PNP transistors facilitate innovative amplifier topologies that deliver high gain-bandwidth at lower power, which is crucial for high-speed analog and optical networking. The platform also supports advanced mmWave industrial radar applications exceeding 100GHz, enabling high-resolution sensing and distance ranging in a reduced form factor [1].

“130CBIC represents a major milestone in our SiGe roadmap, setting a new benchmark for performance for the broad spectrum of high-growth markets that rely on advanced RF technologies for high-speed, energy-efficient connectivity,” said Shankaran Janardhanan, senior vice president of GF’s RF product line [1].

The 130CBIC platform is available for prototyping through GF’s GlobalShuttle multi-project wafer program, with shuttles scheduled through 2025 and 2026. RF reference designs are also available through GF’s self-service GF Connect portal to assist in the design process [1].

GlobalFoundries is a leading manufacturer of essential semiconductors, delivering more power-efficient, high-performance products for various high-growth markets, including automotive, smart mobile devices, internet of things, communications infrastructure, and industrial IoT [1].

References:
[1] https://www.marketscreener.com/news/globalfoundries-announces-production-release-of-130cbic-sige-platform-for-high-performance-smart-mob-ce7c50dfd18cf020