Amkor Technology Raises $500mln Through Notes Offering
PorAinvest
lunes, 8 de septiembre de 2025, 5:51 pm ET1 min de lectura
AMKR--
Pending the use of the proceeds of this offering, Amkor plans to invest the funds in cash, cash equivalents, investment-grade securities, or other short-term marketable securities. The consummation of the offering of the 2033 notes will not be conditioned on the redemption of the 2027 notes [1].
This debt financing move is part of Amkor's strategy to focus on advanced packaging solutions and artificial intelligence technologies. The company has also announced plans to build a new semiconductor advanced packaging and test facility in Arizona, with construction set to begin within days and production expected to start in early 2028 [2]. This new facility is part of Amkor's commitment to strengthening the U.S. semiconductor supply chain.
Amkor reported strong financial results for the fourth quarter and full year 2024, with net sales of $6.32 billion and net income of $354 million. The company's earnings per diluted share were $1.43, and EBITDA was $1.09 billion [3]. Amkor's guidance for the first quarter 2025 projects net sales of $1.225 billion to $1.325 billion and net income of $3 million to $43 million, or $0.01 to $0.17 per diluted share [3].
References:
[1] https://seekingalpha.com/news/4493203-amkor-technology-prices-500-million-of-5875-senior-notes-due-2033
[2] https://www.businesswire.com/news/home/20250828146023/en/Amkor-Announces-New-Site-for-U.S.-Semiconductor-Advanced-Packaging-and-Test-Facility
[3] https://www.businesswire.com/news/home/20250210565899/en/Amkor-Technology-Reports-Financial-Results-for-the-Fourth-Quarter-and-Full-Year-2024
Amkor Technology has priced a $500 million notes offering, expanding its debt financing to support its outsourced semiconductor packaging and test services. The company provides turnkey services, including packaging, test, and drop shipment services, to IDMs, fabless semiconductor companies, OEMs, and contract foundries. This move will allow Amkor to focus its investments on advanced packaging solutions and artificial intelligence technologies.
Amkor Technology (NASDAQ: AMKR), a leading provider of semiconductor packaging and test services, has priced a $500 million aggregate principal amount of its 5.875% senior notes due 2033 in a private placement [1]. The 2033 notes will be senior unsecured obligations of the company, with interest payable semi-annually at a rate of 5.875% per annum on April 1 and October 1 of each year, commencing on April 1, 2026. Amkor intends to use the proceeds to redeem its $400 million aggregate principal amount of 6.625% senior notes due 2027, pay related fees and expenses, and for general corporate purposes [1].Pending the use of the proceeds of this offering, Amkor plans to invest the funds in cash, cash equivalents, investment-grade securities, or other short-term marketable securities. The consummation of the offering of the 2033 notes will not be conditioned on the redemption of the 2027 notes [1].
This debt financing move is part of Amkor's strategy to focus on advanced packaging solutions and artificial intelligence technologies. The company has also announced plans to build a new semiconductor advanced packaging and test facility in Arizona, with construction set to begin within days and production expected to start in early 2028 [2]. This new facility is part of Amkor's commitment to strengthening the U.S. semiconductor supply chain.
Amkor reported strong financial results for the fourth quarter and full year 2024, with net sales of $6.32 billion and net income of $354 million. The company's earnings per diluted share were $1.43, and EBITDA was $1.09 billion [3]. Amkor's guidance for the first quarter 2025 projects net sales of $1.225 billion to $1.325 billion and net income of $3 million to $43 million, or $0.01 to $0.17 per diluted share [3].
References:
[1] https://seekingalpha.com/news/4493203-amkor-technology-prices-500-million-of-5875-senior-notes-due-2033
[2] https://www.businesswire.com/news/home/20250828146023/en/Amkor-Announces-New-Site-for-U.S.-Semiconductor-Advanced-Packaging-and-Test-Facility
[3] https://www.businesswire.com/news/home/20250210565899/en/Amkor-Technology-Reports-Financial-Results-for-the-Fourth-Quarter-and-Full-Year-2024

Divulgación editorial y transparencia de la IA: Ainvest News utiliza tecnología avanzada de Modelos de Lenguaje Largo (LLM) para sintetizar y analizar datos de mercado en tiempo real. Para garantizar los más altos estándares de integridad, cada artículo se somete a un riguroso proceso de verificación con participación humana.
Mientras la IA asiste en el procesamiento de datos y la redacción inicial, un miembro editorial profesional de Ainvest revisa, verifica y aprueba de forma independiente todo el contenido para garantizar su precisión y cumplimiento con los estándares editoriales de Ainvest Fintech Inc. Esta supervisión humana está diseñada para mitigar las alucinaciones de la IA y garantizar el contexto financiero.
Advertencia sobre inversiones: Este contenido se proporciona únicamente con fines informativos y no constituye asesoramiento profesional de inversión, legal o financiero. Los mercados conllevan riesgos inherentes. Se recomienda a los usuarios que realicen una investigación independiente o consulten a un asesor financiero certificado antes de tomar cualquier decisión. Ainvest Fintech Inc. se exime de toda responsabilidad por las acciones tomadas con base en esta información. ¿Encontró un error? Reportar un problema

Comentarios
Aún no hay comentarios