AIM Future and Franklin Wireless Collaborate to Develop Lightweight AI Model and High-Efficiency AI SoC Chipset

AiM Future and Franklin Wireless have signed an MOU to jointly develop a lightweight AI model and a high-efficiency 1 TOPS AI SoC chipset. The collaboration aims to create a module for communication + AI applications, initially targeting the North American market. AiM Future will develop the lightweight AI model, while Franklin Wireless will provide chip specifications and leverage its sales network to deliver the chipsets. The partnership aims to expand the companies' technological reach and bring innovative AI-powered communication solutions to the global IoT and telecommunications markets.

AiM Future and Franklin Wireless have signed a Memorandum of Understanding (MOU) to jointly develop a lightweight AI model and a high-efficiency 1 TOPS AI System-on-Chip (SoC) chipset. The collaboration aims to create a module for communication and AI applications, initially targeting the North American market. AiM Future will focus on developing the lightweight AI model, while Franklin Wireless will provide chip specifications and leverage its extensive sales network to deliver the chipsets.

The partnership aims to expand both companies' technological reach and bring innovative AI-powered communication solutions to the global IoT and telecommunications markets. This strategic alliance leverages AiM Future's expertise in AI model development and Franklin Wireless's strengths in chipset design and market distribution.

According to industry experts, the global AI chipset market is expected to grow at a CAGR of 28.1% during 2025-2030 [1]. This growth is driven by the increasing demand for AI in various applications, including communication, IoT, and edge computing. The partnership between AiM Future and Franklin Wireless is poised to capitalize on this growing market by offering high-efficiency, AI-powered communication solutions.

The collaboration is set to enhance the companies' product portfolios and open new revenue streams. By combining AiM Future's advanced AI capabilities with Franklin Wireless's robust chipset technology, the partnership aims to deliver cutting-edge AI-powered communication modules that meet the evolving needs of the market.

The MOU outlines a roadmap for joint development, with a focus on initial market penetration in the North American region. The companies plan to expand their collaboration globally as the technology matures and market demand grows.

References:
[1] https://finance.yahoo.com/news/ascom-avasure-partner-ai-powered-050000560.html