JNTC TGV

**JNTC's TGV Glass Substrate Introduction and Implications** 1. **New Product Launch**: JNTC has unveiled its new Through-Glass-Via (TGV) glass substrate, which is a significant advancement in semiconductor materials. This product launch was part of JNTC's strategy to offer innovative solutions to the semiconductor industry, particularly for AI and high-performance computing applications. 2. **Technological Breakthrough**: The TGV glass substrate represents a breakthrough from traditional plastic-based substrates. It offers improved flatness, thermal stability, and reduced warpage, which are crucial for high-speed processing and reliability in AI applications. The development of this substrate is a response to the growing demand for more efficient and durable packaging solutions in the AI and semiconductor markets. 3. **Market Positioning**: JNTC's TGV glass substrate is positioned as a critical component for next-generation semiconductor packaging. The company has emphasized its alignment with global semiconductor leaders to validate the performance of its packaging features, such as alignment marks and cavities. 4. **Production and Expansion Plans**: JNTC plans to expand its exports and establish a large-scale manufacturing base in Vietnam. The company aims to produce up to 500,000 units annually, targeting revenue of 200 billion won ($145 million) for 2026 and 1 trillion won by 2028. This expansion is a clear indication of JNTC's confidence in the market potential of its TGV glass substrate. 5. **Competitive Landscape**: The introduction of TGV glass substrates is poised to disrupt the semiconductor packaging market. By leveraging its proprietary technology and strategic partnerships, JNTC is well-positioned to capture a significant share of the advanced packaging market. In conclusion, JNTC's TGV glass substrate is a major development in the semiconductor industry, offering enhanced performance and reliability compared to existing plastic-based solutions. The company's strategic product launch, coupled with its expansion plans, suggests a strong commitment to becoming a key player in the advanced packaging sector.